Specific Process Knowledge/Etch/Wet Titanium Etch: Difference between revisions

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'''Unless anything else is stated, everything on this page, text and pictures are made by DTU Nanolab.'''
 
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'''All measurements on this page has been made by Nanolab staff.'''  


[[Category: Equipment|Etch Wet Titanium]]
[[Category: Equipment|Etch Wet Titanium]]
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==Wet etching of Titanium==
==Wet etching of Titanium==
[[Image:Stinkskab RR2.jpg|250x250px|thumb|Fumehood(RCA) in cleanroom B-1. <br />Wet etching of titanium can be done in the "HF5%/BHF-dirty" bath in this fume hood]]
[[Image:Fumehood1-2.jpg|300x300px|thumb|Fume hood 01 and 02 in Cleanroom D-3 for working with acids and bases.<br>Wet etching of titanium can be done in beakers with BHF or RCA1 mix in a beaker in one of these fume hoods]]
[[Image:Fumehood1-2.jpg|300x300px|thumb|Fume hood 1 and 2 for acids and bases in cleanroom D-3. <br />Wet etching of titanium can also be done in beakers with BHF or RCA1 mix in a beaker in one of these fume hoods]]


We have two solutions for wet titanium etching:
We have two solutions for wet titanium etching:
    
    
# BHF (wetbench or fumehood)
# BHF (beaker in fumehood)
# Cold RCA1 (fumehood)
# Cold RCA1 (beaker in fumehood)
<br>
<br>
Etching titanium in BHF can take place in the 'HF5%/BHF-dirty' bath inside Fumehood(RCA) in cleanroom B-1. This is the only pre-made BHF bath where metals are allowed. You can also do the titanium etch in BHF or RCA1 mix by making your own solution in a beaker in Fumehood 01 or 02 in cleanroom D-3. You can see the APV [http://labmanager.danchip.dtu.dk/d4Show.php?id=2479&mach=146 here].
Etching titanium in BHF or RCA1 mix is made by making your own solution in a beaker in either Fumehood 01 or 02 in Cleanroom D-3. You can see the APV [http://labmanager.danchip.dtu.dk/d4Show.php?id=2479&mach=146 here].




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|-style="background:WhiteSmoke; color:black"
|-style="background:WhiteSmoke; color:black"
|'''Chemical solution'''
|'''Chemical solution'''
|HF:NH<sub>4</sub>F
|HF : NH<sub>4</sub>F : NH<sub>4</sub>HF<sub>2</sub>
|NH<sub>3</sub>OH:H<sub>2</sub>O<sub>2</sub>:H<sub>2</sub>O - 1:1:5
|H<sub>2</sub>O : NH<sub>4</sub>OH : H<sub>2</sub>O<sub>2</sub> - 5:1:1
|-
|-


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Not known (it bubbles while etching)
Not known (it bubbles while etching)
|
|
Not known
50 nm etches in around 2 min
|-
|-


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!Allowed materials
!Allowed materials
|
|
Practically no restrictions when used in beaker or 'HF5%/BHF-dirty' bath in Fumehood(RCA) in cleanroom B-1.  
Practically no restrictions when used in beaker. Make sure to use a plastic beaker, since glass will be attacked by BHF/HF.  
Make a note on the beaker of which materials have been processed.  
Make a note on the beaker of which materials have been processed.  
|
|

Latest revision as of 12:44, 27 June 2024

Feedback to this page: click here

Unless anything else is stated, everything on this page, text and pictures are made by DTU Nanolab.

All links to Kemibrug (SDS) and Labmanager Including APV requires login.

All measurements on this page has been made by Nanolab staff.

Ething of Titanium can be done either wet or dry. For wet etching please see below on this page. Dry etching can be done either with ICP using Chlorine chemistry or with IBE by sputtering with Ar ions.

Wet etching of Titanium

Fume hood 01 and 02 in Cleanroom D-3 for working with acids and bases.
Wet etching of titanium can be done in beakers with BHF or RCA1 mix in a beaker in one of these fume hoods

We have two solutions for wet titanium etching:

  1. BHF (beaker in fumehood)
  2. Cold RCA1 (beaker in fumehood)


Etching titanium in BHF or RCA1 mix is made by making your own solution in a beaker in either Fumehood 01 or 02 in Cleanroom D-3. You can see the APV here.


Comparing the two solutions

BHF Cold RCA1
General description Etch of titanium with or without photoresist mask. Etch of titanium (as stripper or with eagle resist).
Link to safety APV and KBA see APV here

See SDS here (requires Kemibrug login)

see APV here
Chemical solution HF : NH4F : NH4HF2 H2O : NH4OH : H2O2 - 5:1:1
Process temperature Room temperature Room temperature
Possible masking materials

Photoresist (1.5 µm AZ5214E)

Eagle resist

Etch rate

Not known (it bubbles while etching)

50 nm etches in around 2 min

Batch size

1-5 wafers in beaker

1-5 wafers in beaker

Size of substrate Any size and number that can go inside the beaker in use. Any size and number that can go inside the beaker in use.
Allowed materials

Practically no restrictions when used in beaker. Make sure to use a plastic beaker, since glass will be attacked by BHF/HF. Make a note on the beaker of which materials have been processed.

Practically no restrictions when used in beaker. Make a note on the beaker of which materials have been processed.

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