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'''Unless anything else is stated, everything on this page, text and pictures are made by DTU Nanolab.'''
'''Unless anything else is stated, everything on this page, text and pictures are made by DTU Nanolab.'''


'''All links to Kemibrug (SDS) and Labmanager Including APV and QC requires login.'''
'''All links to Labmanager Including APV and QC requires login.'''


== Nickel deposition ==
== Nickel deposition ==
Nickel can be deposited by e-beam evaporation, sputtering or electroplating. In the chart below you can compare the different deposition equipment.
Nickel can be deposited by e-beam evaporation or sputtering at DTU Nanolab. For electroplating you will have to contact other institutes at DTU, e.g., DTU Mechanical Engineering.  


*[[/Electroplating of nickel|Electroplating of nickel]]
Some process information is available here for e-beam evaporated films:
<!--*[[/Electroplating of nickel|Electroplating of nickel]]-->
*[[/Stress Wordentec Ni films|Stress in Wordentec Ni films: study here]].
*[[/Stress Wordentec Ni films|Stress in Wordentec Ni films: study here]].


 
In the chart below you can compare the different deposition equipment:


{| border="1" cellspacing="0" cellpadding="3"  
{| border="1" cellspacing="0" cellpadding="3"  
|-style="background:silver; color:black"
|-style="background:silver; color:black"
!  
!  
! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Temescal|Temescal]])
! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Temescal|E-beam evaporator (Temescal)]] and [[Specific Process Knowledge/Thin film deposition/10-pocket e-beam evaporator|E-beam evaporator (10-pockets)]])
! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Wordentec|Wordentec]])
! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Wordentec|Wordentec]])
! Sputter deposition ([[Specific Process Knowledge/Thin film deposition/Lesker|Lesker]])
! Sputter deposition ([[Specific Process Knowledge/Thin film deposition/Lesker|Lesker]])
! Sputter deposition ([[Specific Process Knowledge/Thin film deposition/Cluster-based multi-chamber high vacuum sputtering deposition system|Sputter-system Metal-Oxide (PC1) and Sputter-system Metal-Nitride (PC3)]])
! Sputter deposition ([[Specific Process Knowledge/Thin film deposition/Cluster-based multi-chamber high vacuum sputtering deposition system|Sputter-system Metal-Oxide (PC1) and Sputter-system Metal-Nitride (PC3)]])
! Electroplating ([[Specific Process Knowledge/Thin film deposition/Electroplating-Ni|Electroplating-Ni]])
|-  
|-  


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|Sputter deposition of Nickel
|Sputter deposition of Nickel
|Sputter deposition of Nickel
|Sputter deposition of Nickel
|Electroplating of Nickel
|-
|-


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|-style="background:LightGrey; color:black"
|-style="background:LightGrey; color:black"
! Pre-clean
! Pre-clean
|Ar ion bombardment
|Ar ion etch (only in E-beam evaporator Temescal)
|
|
|RF Ar clean
|RF Ar clean
|RF Ar clean
|RF Ar clean
|None
|-
|-
|-style="background:WhiteSmoke; color:black"
|-style="background:WhiteSmoke; color:black"
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|10 Å to 5000 Å **
|10 Å to 5000 Å **
|10 Å to 5000 Å **
|10 Å to 5000 Å **
|~ 20 µm to ~ 1000 µm
|-
|-
|-style="background:LightGrey; color:black"
|-style="background:LightGrey; color:black"


! Deposition rate
! Deposition rate
|2-10 Å/s
|1-10 Å/s
|10-15 Å/s
|1-10 Å/s
|Depends on process parameters, about 1 Å/s  
|Depends on process parameters, about 1 Å/s  
|Depends on process parameters, at least ~ 4 Å/s, see conditions [[Specific_Process_Knowledge/Thin_film_deposition/Cluster-based_multi-chamber_high_vacuum_sputtering_deposition_system#Standard_recipe_performance|here]]
|Depends on process parameters, at least ~ 4 Å/s, see conditions [[Specific_Process_Knowledge/Thin_film_deposition/Cluster-based_multi-chamber_high_vacuum_sputtering_deposition_system#Standard_recipe_performance|here]]
|~ 10-250 Å/s


|-style="background:WhiteSmoke; color:black"
|-style="background:WhiteSmoke; color:black"
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*Up to 10x4" or 6" wafers
*Up to 10x4" or 6" wafers
*Many smaller pieces
*Many smaller pieces
|
*1x2" wafer or
*1x4" wafer or
*1x6" wafer


|-
|-
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|
|
* Silicon
*Almost any that does not degas at your intended substrate temperature. See also the [http://labmanager.dtu.dk/function.php?module=XcMachineaction&view=edit&MachID=429 cross-contamination sheet]
*Silicon oxide
*Silicon (oxy)nitride
*Photoresist
*PMMA
*Mylar
*Metals
*See also the [http://labmanager.dtu.dk/function.php?module=XcMachineaction&view=edit&MachID=429 cross-contamination sheet]
|
|
* Silicon
Almost any that does not degas. See the [http://labmanager.dtu.dk/function.php?module=XcMachineaction&view=edit&MachID=167 cross-contamination sheet].
* Silicon oxide
* Silicon nitride
* Silicon (oxy)nitride
* Photoresist
* PMMA
* Mylar
* SU-8
|
|
* Almost any that do not outgas.
* Almost any that do not degas.
|
|
*Almost any that do not outgas. Check the cross-contamination sheet in Labmanager.
*Almost any that does not degas at your intended substrate temperature. See cross contamination sheets for [http://labmanager.dtu.dk/function.php?module=XcMachineaction&view=edit&MachID=441 PC1] and [http://labmanager.dtu.dk/function.php?module=XcMachineaction&view=edit&MachID=442 PC3]
|
 
Base materials:<br>
*Silicon
*Polymers with Tg > 75°C
*Metals (bulk)
*Cross-linked or hard baked resists supported by one of the above mentioned materials
Seed metals:<br>
* NiV (75 - 100 nm recommended)
* Ti (~5 nm) + Au (75-100 nm recommended)
* Cr (~5 nm) + Au (75-100 nm recommended)
* TiW
* Cr
|-
|-
|-
|-
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|
|
*May use high-strength magnet for deposition
*May use high-strength magnet for deposition
|
*Sample must be compatible with plating bath (pH = 3,65 and T = 52°C). Seed metal necessary.
|-
|-


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|-
|-
|
|
*[http://labmanager.dtu.dk/d4Show.php?id=3736&mach=167 QC procedure for Wordentec]<br>
Nickel deposition is tested occasionally, around 1-2 times per year. LabManager links require login.
*[https://labmanager.dtu.dk/view_binary.php?type=data&mach=167 The newest QC data for Wordentec]<br>
*[http://labmanager.dtu.dk/d4Show.php?id=3736&mach=167 QC procedure for Wordentec in LabManager]<br>
*[https://labmanager.dtu.dk/view_binary.php?type=data&mach=167 The newest QC data for Wordentec in LabManager]<br>


{| {{table}}
{| {{table}}
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|-
|-
|
|
*[http://labmanager.dtu.dk/d4Show.php?id=5862&mach=429 QC procedure for the Temescal]<br>
Nickel deposition is tested occasionally, around 1 time per year. LabManager links require login.
*[https://labmanager.dtu.dk/view_binary.php?type=data&mach=429 The newest QC data for the Temescal]<br>
*[http://labmanager.dtu.dk/d4Show.php?id=5862&mach=429 QC procedure for the Temescal in LabManager]<br>
*[https://labmanager.dtu.dk/view_binary.php?type=data&mach=429 The newest QC data for the Temescal in LabManager]<br>


{| {{table}}
{| {{table}}
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|}
|}
Thickness is measured in 5 points with a stylus profiler. <br>
Thickness is measured in 5 points with a stylus profiler. <br>
Additionally we examine the newly deposited films for particles using the particle scanner (if available, otherwise we use the Jenatech microscope in darkfield mode) and we monitor the sheet resistance of the Ti/Au films.
|}
|}
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