Specific Process Knowledge/Thin film deposition/Electroplating-Ni: Difference between revisions

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-'''Feedback to this page''': '''[mailto:CustomerSupport@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Thin_film_deposition/Electroplating-Ni click here]'''
+'''Feedback to this page''': '''[mailto:fabricationSupport@Nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Thin_film_deposition/Electroplating-Ni click here]'''
-[[Category: Equipment]]
+'''Unless anything else is stated, everything on this page, text and pictures are made by DTU Nanolab.'''
-[[Category: Thin Film Deposition]]
-== Technotrans microform.200 ==
+'''THIS MACHINE HAS BEEN DECOMMISSIONED'''
-[[image:choi_2017_Machine_overview.jpg|200x200px|right|thumb|Electroplating-Ni positioned in cleanroom A-1]]
+[[Category: Equipment|Thin film Electroplating Ni]]
+[[Category: Thin Film Deposition|Electroplating Ni]]
-The Technotrans microform.200 (Electroplating-Ni in LabManager) is a machine capable of depositing nickel electrochemically. This is done by lowering the sample into an electrolyte containing nickel ions and then apply a voltage across the sample and the anode. The anode is a basket filled with nickel pellets. The cathode is the sample to be coated with nickel.
+== Technotrans microform.200 - DECOMMISSIONED==
+[[image:Electroplater-D3.jpg|200x200px|right|thumb|Electroplating-Ni positioned in cleanroom D-3]]
+The Technotrans microform.200 (Electroplating-Ni in LabManager) is a machine capable of depositing nickel electrochemically. This is done by lowering the sample into an electrolyte containing nickel ions and then apply a voltage across the sample and the anode. The anode is a titanium basket filled with nickel pellets. The cathode is the sample to be coated with nickel.
 At the anode metallic nickel is oxidized to nickel ions:
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 The minimal charge accepted by the software on the machine is 0.1 Ah (Ampere-hours). This corresponds to roughly 2 µm of nickel on a four inch wafer. You can abort a program prematurely to achieve even lower thicknesses, but this requires manual control of the machine.
-The maximum allowed thickness is ~1,4 mm (1400 µm), since a higher thickness will make the release of the sample difficult and likely damage the sample holder. This corresponds to a charge of 53-54 Ah on a four inch wafer.
+The maximum allowed thickness is ~1,4 mm (1400 µm), since a higher thickness will make the release of the sample difficult and likely damage the sample holder. This corresponds to a charge of 53-54 Ah on a four inch wafer. Please contact Nanolab before processing your wafer if you intend to deposit more than ~500 µm of nickel, since this can involve special challenges regarding uniformity, roughness and sample release after plating.
-The plating bath is an aqueous solution of nickel sulfamate, boric acid and sulfamic acid. The bath is moderately acidic (pH = 3,5 - 3,8) and the temperature of the bath is around 52°C. The sample will spin at 60 RPM during deposition.
+The plating bath is an aqueous solution of nickel sulfamate, boric acid and sulfamic acid. The bath is moderately acidic (pH = 3,70). The pH is kept constant by an automatic pH measurement and sulfamic acid dosing module. The temperature of the bath is 52°C. The sample will spin at 60 RPM during deposition.
 Uniformity across a 4" wafer is around 5% for the standard processes (the edge being slightly thicker than the center of the sample). Running at high current densities will deposit a nickel layer that is quite soft. Decreasing current density will increase tensile strength of the deposited nickel.
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 <!-- give the link to the equipment info page in LabManager: -->
-[http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=274 Electroplating-Ni Info on LabManager]
+[http://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=274 Electroplating-Ni Info on LabManager]
 == Process information ==
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 |style="background:LightGrey; color:black"|Temperature
 |style="background:WhiteSmoke; color:black"|
-*C
+°C
 |-
 |style="background:LightGrey; color:black"|pH
 |style="background:WhiteSmoke; color:black"|
-,5 - 3,8
+,5 - 3,8 (Recommended by manufacturer)
 |-
 !style="background:silver; color:black" align="center" valign="center" rowspan="3"|Sample requirements
 |style="background:LightGrey; color:black"|Seed metal
 |style="background:WhiteSmoke; color:black"|
-nm of either NiV, Ti+Au or Cr+Au recommended. Most commonly seed metals are sputtered using the [[Specific Process Knowledge/Thin film deposition/Lesker|Sputter-System(Lesker)]].
+Most commonly ~85-100 nm of NiV
 |-
 | style="background:LightGrey; color:black"|Allowed materials
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 |style="background:LightGrey; color:black"|Thickness
 |style="background:WhiteSmoke; color:black"|
-- 1400 µm
+~20 - 1000 µm
 |-
 |style="background:LightGrey; color:black"|Uniformity
 |style="background:WhiteSmoke; color:black"|
-Around 10% (depending on sample and process)
+Around 2-10% (depending on sample and process)
 |-
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 |style="background:LightGrey; color:black"|Temperature
 |style="background:WhiteSmoke; color:black"|
-*C
+°C
 |-
 |style="background:LightGrey; color:black"|pH
 |style="background:WhiteSmoke; color:black"|
-,5 - 4,0 (3,5 - 3,8 recommended by manufacturer)
+~3,65 (maintained automatically)
 |-
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 |style="background:WhiteSmoke; color:black"|
 *Most materials '''except copper and cobalt'''.
-*Ask Danchip for details.
+*Ask Nanolab for details.
 |-
 |}