Specific Process Knowledge/Characterization/XRD/XRD SmartLab: Difference between revisions

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'''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Characterization/XRD/XRD_SmartLab click here]'''
'''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Characterization/XRD/XRD_SmartLab click here]'''
<i> Unless otherwise stated, this page is written by <b>DTU Nanolab internal</b><br>
All images and photos on this page belongs to <b>DTU Nanolab</b></i>


= XRD SmartLab =
= XRD SmartLab =
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The Rigaku SmartLab is an advanced XRD for measuring on thin films. All thin films can be measured without fixating the sample, as the system has a so called In-Plane arm.
The Rigaku SmartLab is an advanced XRD for measuring on thin films. All thin films can be measured without fixating the sample, as the system has a so called In-Plane arm.


[[image:XRD_SmartLab.jpg|200x200px|right|thumb|The XRD SmartLab located in cleanroom F-2]]
[[image:XRD_SmartLab.jpg|400x400px|right|thumb|The XRD SmartLab located in cleanroom F-2]]




'''The user manual(s), user APV(s), technical information, and contact information can be found in LabManager:'''  
'''The user manual(s), user APV(s), technical information, and contact information can be found in LabManager:'''  


[http://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=428 XRD SmartLab in LabManager]
[http://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=428 XRD SmartLab in LabManager] - requires login




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The measurement settings and results of the pre-acceptance test are described in this document, also found on the Cleanroom drive:
The measurement settings and results of the pre-acceptance test are described in this document, also found on the Lab Manager:
[[:File:SmartLab_Report_DTUv1.pdf]]
 
*[https://labmanager.dtu.dk/view_binary.php?fileId=5413| (FAT) Factory Acceptance Test] - requires login
 
The same measurement were completed as part of the acceptance, but no report was generated. In addition the inspection certificate is available here:


The same measurement were completed as part of the acceptance, but no report was generated. In addition the inspection certificate is available here: [[:File:Inspection certificate.pdf]]
*[https://labmanager.dtu.dk/view_binary.php?fileId=5414| (SAT) Site Acceptance Test] - requires login




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* Characterization of [[Specific_Process_Knowledge/Thin_film_deposition/Deposition_of_Aluminium/Al_Ebeam_evaporation_in_Temescal|e-beam deposited Al thin films]].
* Characterization of [[Specific_Process_Knowledge/Thin_film_deposition/Deposition_of_Aluminium/Al_Ebeam_evaporation_in_Temescal|e-beam deposited Al thin films]].


* Characterization of [[Specific_Process_Knowledge/Characterization/XRD/XRD_SmartLab/ALD_deposited_alumina_and_titania_XRR|ALD deposited Al<sub>2</sub>O<sub>3</sub> and TiO<sub>2</sub> ultrathin layers]].
* Characterization of [[Specific_Process_Knowledge/Thin_film_deposition/Deposition_of_Aluminium/Al_Sputtering_in_Cluster_Lesker_PC3#X-ray_reflectivity_analysis|DC sputtered Al thin films]].
 
* Characterization of [[Specific_Process_Knowledge/Characterization/XRD/XRD_SmartLab/ALD_deposited_alumina_and_titania_XRR#X-ray_reflectivity_results|ALD deposited Al<sub>2</sub>O<sub>3</sub> and TiO<sub>2</sub> ultrathin layers]].
 
* Characterization of [[Specific_Process_Knowledge/Thin_film_deposition/Deposition_of_CrSi#X-ray_Reflectivity_Analysis|Sputtered deposited CrSi bilayer]].


<!-- * .-->
* Characterization of [[Specific_Process_Knowledge/Thin_film_deposition/Deposition_of_MgO#X-Ray_Reflectivity|Sputtered deposited MgO thin films]].


Characterization of [[Specific_Process_Knowledge/Characterization/XRD/XRD_SmartLab/ALD_deposited_alumina_and_titania_XRR_and_SE_comparison|ALD deposited Al<sub>2</sub>O<sub>3</sub> and TiO<sub>2</sub> ultrathin layers]]
* Characterization of [[Specific_Process_Knowledge/Thin_film_deposition/Deposition_of_Scandium/Sc_Sputtering_in_Cluster_Lesker_PC3#X-ray_Reflectivity_(XRR)|Sputtered deposited Sc thin films]].
 
* Characterization of [[Specific_Process_Knowledge/Thin_film_deposition/Deposition_of_Scandium_Nitride/ScN_Reactive_Sputtering_in_Cluster_Lesker_PC3#X-ray_Reflectivity_(XRR)|Sputtered deposited ScN thin films]].
 
<!-- * Characterization of [[Specific_Process_Knowledge/Characterization/XRD/XRD_SmartLab/ALD_deposited_alumina_and_titania_XRR_and_SE_comparison|ALD deposited Al<sub>2</sub>O<sub>3</sub> and TiO<sub>2</sub> ultrathin layers]].-->
 
==Grazing Incidence X-ray Diffraction XRD (GiXRD)==
 
* Evaluation of [[Specific Process Knowledge/Characterization/XRD/XRD SmartLab/Instrumental broading in GiXRD|Instrumental broading in GiXRD]].


==Equipment performance and process related parameters==
==Equipment performance and process related parameters==
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0.4 mm x 8 mm (Line/Point)
0.4 mm x 8 mm (Line/Point)
|-
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="5"|Goniometer
!style="background:silver; color:black" align="center" valign="center" rowspan="4"|Goniometer
|style="background:LightGrey; color:black"|
|style="background:LightGrey; color:black"|
Scanning mode
Scanning mode
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*Rx,Ry:-5~+5°
*Rx,Ry:-5~+5°
|-
|-
|style="background:LightGrey; color:black"|
 
Sample size
|style="background:WhiteSmoke; color:black"|
Diameter: 150 mm
Thickness: 0~21 mm
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="2"|Optics
!style="background:silver; color:black" align="center" valign="center" rowspan="2"|Optics
|style="background:LightGrey; color:black"|Incident side
|style="background:LightGrey; color:black"|Incident side
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|style="background:LightGrey; color:black"|Substrate size
|style="background:LightGrey; color:black"|Substrate size
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
up to 150 mm wafers
up to 150 mm wafers; thickness up to 21 mm
|-
|-
| style="background:LightGrey; color:black"|Allowed materials
| style="background:LightGrey; color:black"|Allowed materials
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
All materials
All materials allowed in the cleanroom
|-  
|-  
|}
|}


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<br clear="all" />

Revision as of 16:42, 9 November 2023

Feedback to this page: click here

Unless otherwise stated, this page is written by DTU Nanolab internal
All images and photos on this page belongs to DTU Nanolab


XRD SmartLab

The Rigaku SmartLab is an advanced XRD for measuring on thin films. All thin films can be measured without fixating the sample, as the system has a so called In-Plane arm.

The XRD SmartLab located in cleanroom F-2


The user manual(s), user APV(s), technical information, and contact information can be found in LabManager:

XRD SmartLab in LabManager - requires login


Various measurement types including X-Ray reflectivity, Rocking curve, Theta-2theta, and Pole figures are described here:

Process information


The measurement settings and results of the pre-acceptance test are described in this document, also found on the Lab Manager:

The same measurement were completed as part of the acceptance, but no report was generated. In addition the inspection certificate is available here:


Software for analysis

Please see the Data Analysis section at the main XRD page.

Characterization of thin films using X-ray reflectivity (XRR)

Implementing the XRR method the user can calculate thickness, density, and roughness of the deposited material. The XRR is also widely employed for multilayer stack analysis.

Here are some results available:


Grazing Incidence X-ray Diffraction XRD (GiXRD)

Equipment performance and process related parameters

Equipment XRD SmartLab
Purpose Crystal structure analysis and thin film thickness measurement
  • Phase ID
  • Crystal Size
  • Crystallinity
  • Quality and degree of orientation
  • 3D orientation
  • Latice strain
  • Composition
  • Twist
  • 3D lattice constant
  • Thickness
  • Roughness
  • Density
X-ray generator

Maximum rated output

3 kW

Rated tube voltage

20 to 45 kV

Rated tube current

2 to 60 mA

Type

Sealed tube

Target

Cu

Focus size

0.4 mm x 8 mm (Line/Point)

Goniometer

Scanning mode

incident / receiver coupled or independent

Goniomenter radius

300 mm

Minimum step size

0.0001° (0.36")

Sample stage

  • χ:-5~+95°
  • φ:0~360°
  • Z:-4~+1 mm
  • X,Y:±50 mm for a 100 mm wafer
  • Rx,Ry:-5~+5°
Optics Incident side
  • Cross Beam Optics(CBO)
  • Ge(220)x2 monochromator
  • In-Plane Parallel Slit Collimator (PSC)
  • Soller slit
  • Variable divergence slit
Receiver side
  • Automatic variable scattering slit
  • Automatic variable receiver slit
  • Parallel slit analysers (PSA)
  • Ge(220)x2 analyser
Substrates Substrate size

up to 150 mm wafers; thickness up to 21 mm

Allowed materials

All materials allowed in the cleanroom


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