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New page: Tin can be deposited by e-beam evaporation. In the chart below you can compare the different deposition equipment. {| border="1" cellspacing="0" cellpadding="4" ! ! E-beam evaporation ...
 
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Tin can be deposited by e-beam evaporation. In the chart below you can compare the different deposition equipment.
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{| border="1" cellspacing="0" cellpadding="4"  
== Tin deposition ==
 
Tin can be deposited by e-beam evaporation. It was evaporated in the Alcatel e-beam evaporator, which is decommissioned, but has not yet been evaporated in the Temescal e-beam evaporator which we have now (June 2023). Please contact the Thin Film group if you would like to deposit tin.
 
{| border="1" cellspacing="0" cellpadding="3"
|-style="background:silver; color:black"
!  
!  
! E-beam evaporation (Alcatel)
! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Temescal|Temescal]])
! E-beam evaporation (Leybold)
|-  
|-  
| Batch size
|-style="background:WhiteSmoke; color:black"
|
! General description
*Up to 1x4" wafers
| E-beam deposition of Sn
*smaller pieces
(line-of-sight deposition)
|
*8x4" wafers or
*5x6" wafers
|-
|-
| Pre-clean
|-style="background:LightGrey; color:black"
|RF Ar clean
!Pre-clean
|Ar ion bombartment
|Ar ion  clean
|-
|-
| Layer thickness
|-style="background:WhiteSmoke; color:black"
|10Å to 1µm  
!Layer thickness
|10Å to 1500Å
|10Å to 1µm*
|-
|-
| Deposition rate
|-style="background:LightGrey; color:black"
|2Å/s to 15Å/s
! Deposition rate
|1Å/s to 5Å/s
|1Å/s to 10Å/s
|-
|-
|-style="background:WhiteSmoke; color:black"
!Pre-clean
|Ar ion bombardment
|-style="background:LightGrey; color:black"
! Batch size
|
*Up to 4x6" wafers
*Up to 3x8" wafers (ask for holder)
*small pieces
|-
|-style="background:WhiteSmoke; color:black"
!Allowed materials
|
* Silicon
*Silicon oxide
*Silicon (oxy)nitride
*Photoresist
*PMMA
*Mylar
*Metals
*See also the [http://labmanager.dtu.dk/function.php?module=XcMachineaction&view=edit&MachID=429 cross-contamination sheet]
|-style="background:LightGrey; color:black"
! Comment
| Tin has not yet been deposited in the Temescal to date (May 2022).
Please contact the Thin Film group if you would like us to develop the process.
|}
|}
'''*''' ''For thicknesses above 600 nm permission is required.''
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