Specific Process Knowledge/Thin film deposition/Temescal/Acceptance Test: Difference between revisions
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==Temescal acceptance test == | ==Temescal acceptance test == | ||
[[File:w26 with resist02.jpg|400px|right|thumb|Si wafer with 1 µm tall nLOF resist pattern and 10 nm Ti/100 nm Au on top. The side wall is free of deposition.]] | [[File:w26 with resist02.jpg|400px|right|thumb|Si wafer with 1 µm tall nLOF resist pattern and 10 nm Ti/100 nm Au on top. The side wall is free of deposition.]] | ||
In the acceptance test, we tested the vacuum performance, the ion source, and the uniformity of the deposited metal films. The test was made in March 2018 by Rebecca Ettlinger. | In the acceptance test, we tested the vacuum performance, the ion source, and the uniformity of the deposited metal films. The test was made in March 2018 by Rebecca Ettlinger and Camilla Tingsager. | ||
The uniformity of the ion beam etch was tested on Si wafers with SiO<sub>2</sub> coating of a known thickness. | The uniformity of the ion beam etch was tested on Si wafers with SiO<sub>2</sub> coating of a known thickness. It was measured by ellipsometry. | ||
For metal films | For metal films the thickness was measured with a stylus profiler and for Ti/Ni the sheet resistance uniformity was measured by Capres. | ||
Side wall coverage was evaluated in SEM for Ti/Au films deposited at normal incidence (what most users require, which gives no side-wall deposition) and with various degrees of tilt. | Side wall coverage was evaluated in SEM for Ti/Au films deposited at normal incidence (what most users require, which gives no side-wall deposition) and with various degrees of tilt. | ||
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The thickness uniformity was not tested for the 8" sample holder nor for the tilted sample holder. | The thickness uniformity was not tested for the 8" sample holder nor for the tilted sample holder. | ||
We cannot guarantee that the batch-to-batch thickness reproducibility will always be below 3 % as there may be more drift over longer times. We check the thickness of a Ti/Au deposition every month and ensure that it is within 10 % of the expected value and | We cannot guarantee that the batch-to-batch thickness reproducibility will always be below 3 % as there may be more drift over longer times. We check the thickness of a Ti/Au deposition every month and ensure that it is within 10 % of the expected value and in most cases the variation has been much less than 10 %. You can see the deviation over time in the QC data which is found in LabManager under Documents or ask staff for the detailed data. | ||
== Sheet resistance uniformity == | == Sheet resistance uniformity == | ||