Specific Process Knowledge/Etch/DRIE-Pegasus/showerheadchange/ProcessA: Difference between revisions

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<!--Page reviewed by jmli 9/8-2022  -->
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! width="40" | Comments
! width="40" | Comments
|-
|-
| 3/12-2014
| 18/8-2014
| 1/4 6" Wafer with 210 nm oxide and 1800 nm polysilicon CB on oxide carrier
| 4" Nanolab QC Wafer  
| standard stepper mask (50 nm barc + 320 nm krf)
| 1.5 µm AZ resist, daq2 mask
| Si / 50+ %  
| Si / 10 %  
| Pegasus/jmli
| Pegasus/jmli
| 10 minute TDESC clean + 45 sec barc etch
| 10 minute TDESC clean, 10 minute PR strip post process
| danchip/showerhead/Cpoly1, 20 cycles or 2:04 minutes  
| nanolab/QC/QCprocA, 55 cycles (11+44) or 10:05 minutes  
| S004724
| S004257
| New showerhead  
! OLD showerhead  
|  
|  
[[file:S004724-01.jpg|150px|frameless ]]
[[file:S004257-08.jpg|150px|frameless ]]
[[file:S004724-02.jpg|150px|frameless ]]
[[file:S004257-09.jpg|150px|frameless ]]
[[file:S004724-03.jpg|150px|frameless ]]
[[file:S004257-10.jpg|150px|frameless ]]
[[file:S004257-11.jpg|150px|frameless ]]
[[file:S004257-12.jpg|150px|frameless ]]
[[file:S004257-13.jpg|150px|frameless ]]
[[file:S004257-14.jpg|150px|frameless ]]
|-
| 20/11-2014
| 4" Nanolab QC Wafer
| 1.5 µm AZ resist, daq2 mask
| Si / 10 %
| Pegasus/jmli
| 10 minute TDESC clean, 10 minute PR strip post process
| Nanolab/QC/QCprocA, 55 cycles (11+44) or 10:05 minutes
| S004580
! OLD showerhead
|
[[file:S004580-01.jpg|150px|frameless ]]
[[file:S004580-02.jpg|150px|frameless ]]
[[file:S004580-03.jpg|150px|frameless ]]


|-
|-
| 1/12-2014
| 4" Nanolab QC Wafer
| 1.5 µm AZ resist, daq2 mask
| Si / 10 %
| Pegasus/jmli
| 10 minute TDESC clean, 10 minute PR strip post process
| Nanolab/QC/QCprocA, 55 cycles (11+44) or 10:05 minutes
| S004671
! New showerhead
|
[[file:S004671-04.jpg|150px|frameless ]]
[[file:S004671-05.jpg|150px|frameless ]]
[[file:S004671-06.jpg|150px|frameless ]]
[[file:S004671-07.jpg|150px|frameless ]]
|-
| 15/12-2014
| 4" Nanolab QC Wafer
| 1.5 µm AZ resist, daq2 mask
| Si / 10 %
| Pegasus/jmli
| 10 minute TDESC clean, 10 minute PR strip post process
| Nanolab/QC/QCprocA, 55 cycles (11+44) or 10:05 minutes
| S004746
! New showerhead
|
[[file:S004746-01.jpg|150px|frameless ]]
[[file:S004746-02.jpg|150px|frameless ]]
[[file:S004746-03.jpg|150px|frameless ]]
[[file:S004746-04.jpg|150px|frameless ]]
[[file:S004746-05.jpg|150px|frameless ]]
[[file:S004746-06.jpg|150px|frameless ]]
[[file:S004746-07.jpg|150px|frameless ]]
|-
|}
|}

Latest revision as of 11:23, 28 April 2023

Unless otherwise stated, all content on this page was created by Jonas Michael-Lindhard, DTU Nanolab

Process runs
Date Substrate Information Process Information SEM Images
Wafer info Mask Material/ Exposed area Tool / Operator Conditioning Recipe Wafer ID Comments
18/8-2014 4" Nanolab QC Wafer 1.5 µm AZ resist, daq2 mask Si / 10 % Pegasus/jmli 10 minute TDESC clean, 10 minute PR strip post process nanolab/QC/QCprocA, 55 cycles (11+44) or 10:05 minutes S004257 OLD showerhead

20/11-2014 4" Nanolab QC Wafer 1.5 µm AZ resist, daq2 mask Si / 10 % Pegasus/jmli 10 minute TDESC clean, 10 minute PR strip post process Nanolab/QC/QCprocA, 55 cycles (11+44) or 10:05 minutes S004580 OLD showerhead

1/12-2014 4" Nanolab QC Wafer 1.5 µm AZ resist, daq2 mask Si / 10 % Pegasus/jmli 10 minute TDESC clean, 10 minute PR strip post process Nanolab/QC/QCprocA, 55 cycles (11+44) or 10:05 minutes S004671 New showerhead

15/12-2014 4" Nanolab QC Wafer 1.5 µm AZ resist, daq2 mask Si / 10 % Pegasus/jmli 10 minute TDESC clean, 10 minute PR strip post process Nanolab/QC/QCprocA, 55 cycles (11+44) or 10:05 minutes S004746 New showerhead