Specific Process Knowledge/Etch/Etching of Chromium: Difference between revisions

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Ething of Chromium can be done either wet or dry. For wet etching please see below on this page. Dry etching can be done either with [[Specific Process Knowledge/Etch/ICP Metal Etcher|ICP]] using Chlorine chemistry or with IBE by sputtering with Ar ions.  
'''Unless anything else is stated, everything on this page, text and pictures are made by DTU Nanolab.'''


==Wet etching of Chromium==
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[[Image:fumehoodetch-chrom.jpg|300x300px|thumb|Fume hood: positioned in cleanroom 2. <br />Wet Etch of Chromium can take place in a beaker in this fume hood]]
Wet etching of chromium at Danchip is done making your own set up in a beaker in a fume hood - preferably in cleanroom 2 or 4. We have two solution for this:


# HNO<math>_3</math>:H<math>_2</math>O:cerisulphate - 90ml:1200ml:15g - standard at Danchip
'''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Etch/Etching_of_Chromium click here]'''
# Commercial chromium etch
<!--Page reviewed by jmli 1/8-2016  -->
<!--Page reviewed by jmli 9/8-2022 -->


Etch rate are depending on the level of oxidation of the metal.


====How to mix the Chromium etch 1:====
==Etching of Chromium==
#Take a beaker and add 15g of cerisulphate.
#Add a little water while stirring - make sure all lumps are gone.
#Add water until 600 ml - keep stirring (use magnetic stirring)
#Add 90 ml HNO<math>_3</math>
#When the cerisulphate is completely dissolved (clear liquid) you can add the other 600 ml of wafer.


Etching of chromium can be done either by wet etch, dry etch or by sputtering with ions.
*[[Specific Process Knowledge/Etch/Wet Chromium Etch|Etching of Cr by wet etch]]
*[[Specific Process Knowledge/Etch/ICP Metal Etcher/Chromium|Etching of Cr by ICP metal]]
*[[Specific_Process_Knowledge/Etch/IBE&frasl;IBSD Ionfab 300|Sputtering of Cr]]
<br clear="all" />


<br clear="all" />
==Comparison of Chromium Etch Methods==
 
{|border="1" cellspacing="1" cellpadding="3" style="text-align:left;"  
|-


===Overview of the data for the chromium etches===
{| border="1" cellspacing="0" cellpadding="4"
!
! Chromium etch 1
! Chromium etch 2
|-
| '''General description'''
|
Etch of chromium
|
Etch of chromium
|-
|-
| '''Chemical solution'''
|-style="background:silver; color:black"
|HNO<math>_3</math>:H<math>_2</math>O:cerisulphate  - 90ml:1200ml:15g
!
|.
![[Specific Process Knowledge/Etch/Wet Chromium Etch|Cr wet etch]]
![[Specific_Process_Knowledge/Etch/ICP_Metal_Etcher|ICP metal]]
![[Specific_Process_Knowledge/Etch/IBE&frasl;IBSD Ionfab 300|IBE (Ionfab300+)]]
|-
|-
| '''Process temperature'''
|Room temperature


|.
|-
|-style="background:WhiteSmoke; color:black"
!Generel description
|Wet etch of Cr premixed (Chrome etch 18)
|Dry plasma etch of Cr
|Sputtering of Cr - pure physical etch
|-


|-
|-
 
|-style="background:LightGrey; color:black"
| '''Possible masking materials'''
!Etch rate range
|
|
Photoresist (1.5 µm AZ5214E)
*~150nm/min at room temperature
|
|
.
*~14 nm/min (depending on features size and etch load)
|
*~30nm/min (not tested yet)
|-
 
|-
|-
|'''Etch rate'''
|-style="background:WhiteSmoke; color:black"
!Etch profile
|
*Isotropic
|
|
~40-100 nm/min
*Anisotropic (vertical sidewalls)
|
|
.
*Anisotropic (angles sidewalls, typical around 70 dg)
|-
 
 
|-
|-
|'''Batch size'''
|-style="background:LightGrey; color:black"
!Substrate size
|
*Any size and number that can go inside the beaker in use
|
|
1-25 wafers at a time
*smaller pieces on a carrier wafer
*<nowiki>#</nowiki>1 100mm wafers (when set up to 100mm wafers)
*<nowiki>#</nowiki>1 150mm wafers (when set up to 150mm wafers)
|
|
.
Smaller pieces glued to carrier wafer
*<nowiki>#</nowiki>1 50mm wafer
*<nowiki>#</nowiki>1 100mm wafer
*<nowiki>#</nowiki>1 150mm wafer
*<nowiki>#</nowiki>1 200mm wafer
|-
 
|-
|-
|'''Size of substrate'''
|-style="background:WhiteSmoke; color:black"
|
!Allowed materials
4" wafers
|
|
.
No restrictions cross contamination wise as long as you use the right beaker and make sure that they are safe to enter in the chemicals
|-
|'''Allowed materials'''
|
|
No restrictions.
*Silicon
Make a note on the bottle of which materials have been processed.
*Quartz/fused silica
*Photoresist/e-beam resist
*PolySilicon,
*Silicon oxide
*Silicon (oxy)nitride
*Aluminium
*Titanium
*Chromium
|
|
.
*Silicon
*Silicon oxides
*Silicon nitrides
*Metals from the +list
*Metals from the -list
*Alloys from the above list
*Stainless steel
*Glass
*III-V materials
*Resists
*Polymers
*Capton tape
|-
|-
|}
|}
== Dry etching of chromium ==
On the [[Specific Process Knowledge/Etch/ICP Metal Etcher|ICP Metal Etch]] tool a recipe for chromium is being developed.

Latest revision as of 16:47, 6 February 2023

Unless anything else is stated, everything on this page, text and pictures are made by DTU Nanolab.

All links to Kemibrug (SDS) and Labmanager Including APV and QC requires login.

Feedback to this page: click here


Etching of Chromium

Etching of chromium can be done either by wet etch, dry etch or by sputtering with ions.


Comparison of Chromium Etch Methods

Cr wet etch ICP metal IBE (Ionfab300+)
Generel description Wet etch of Cr premixed (Chrome etch 18) Dry plasma etch of Cr Sputtering of Cr - pure physical etch
Etch rate range
  • ~150nm/min at room temperature
  • ~14 nm/min (depending on features size and etch load)
  • ~30nm/min (not tested yet)
Etch profile
  • Isotropic
  • Anisotropic (vertical sidewalls)
  • Anisotropic (angles sidewalls, typical around 70 dg)
Substrate size
  • Any size and number that can go inside the beaker in use
  • smaller pieces on a carrier wafer
  • #1 100mm wafers (when set up to 100mm wafers)
  • #1 150mm wafers (when set up to 150mm wafers)

Smaller pieces glued to carrier wafer

  • #1 50mm wafer
  • #1 100mm wafer
  • #1 150mm wafer
  • #1 200mm wafer
Allowed materials

No restrictions cross contamination wise as long as you use the right beaker and make sure that they are safe to enter in the chemicals

  • Silicon
  • Quartz/fused silica
  • Photoresist/e-beam resist
  • PolySilicon,
  • Silicon oxide
  • Silicon (oxy)nitride
  • Aluminium
  • Titanium
  • Chromium
  • Silicon
  • Silicon oxides
  • Silicon nitrides
  • Metals from the +list
  • Metals from the -list
  • Alloys from the above list
  • Stainless steel
  • Glass
  • III-V materials
  • Resists
  • Polymers
  • Capton tape
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