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Specific Process Knowledge/Lithography/ARN8200: Difference between revisions

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Allresist also provides these [https://www.allresist.com/wp-content/uploads/sites/2/2020/03/SXAR-N8200-1_english_Allresist_product_information.pdf processing guidelines.]
Allresist also provides these [https://www.allresist.com/wp-content/uploads/sites/2/2020/03/SXAR-N8200-1_english_Allresist_product_information.pdf processing guidelines.]


== Contrast curve ==
== Contrast curve @ 100 kV (JEOL 9500) ==
 
Exposure dose for AR-N 8200 is very dependent on Post Exposure Bake (PEB) temperature. A contrast curve for four different PEB processes were obtained with the following process parameters.


Exposure dose for AR-N 8200 is very dependent on Post Exposure Bake (PEB) temperature. A contrast curve for four different PEB processes were obtained by the following process parameters.


{|border="1" cellspacing="0" cellpadding="3" style="text-align:left;"  style="width: 95%"
{|border="1" cellspacing="0" cellpadding="3" style="text-align:left;"  style="width: 95%"
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|-
|-
|-style="background:WhiteSmoke; color:black"
|-style="background:WhiteSmoke; color:black"
|AR-N8200.06 AllResist
|AR-N8200.06
|LabSpin E-5, 4000 rpm, 60s, softbaked 10 min @ 150 degC
|LabSpin 2, 4000 rpm for 60s, softbake 10 min @ 150 degC, thickness is 110 nm
|09-02-2016, JBX9500 E-2, 2nA aperture 5, doses 40-600 µC/cm2, 100 nm lines and 300 nm spaces
|JBX9500, 60 nA, doses 100-1600 µC/cm2, 150 µm x 300 µm rectangles
|11-02-2016, Fumehood D-2, AR-600-546, rinsed in IPA 60s.
|Labspin 2 hotplate, 130, 150, 160 or 170 degC for 10 min
|02-03-2016 AFM Icon, F-2, ScanAsyst in Air
|EBL development fumehood, 60 sec development in AR300-47:DIW (1:1), 30 sec rinse in DIW, nitrogen gun dry
|-
|-


|}
|}


Spin coating
 
Labspin 2
Hotplate temperatures are assumed surface temperatures based on the 0.90 correction factor in use on the hotplate.
 
 
The resulting resist structure height is mapped with Dektak XTa and plotted as a contrast curve below. It is apparent that the dose and contrast is very dependent on the PEB parameters.




[[file:ARN8200DoseCurve.png]]
[[file:ARN8200DoseCurve.png]]
== Results at 30 kV (Raith eLINE) ==
A dose test is carried out with the following parameters
{|border="1" cellspacing="0" cellpadding="3" style="text-align:left;"  style="width: 95%"
|-
|-
|-style="background:Black; color:White"
!colspan="5"|AR-N 8200 30 kV dose test, Processed by THOPE, AUG 2022
|-
|-
|-style="background:WhiteSmoke; color:black"
!Resist
!Spin Coat
!E-beam exposure
!PEB
!Development
|-
|-
|-style="background:WhiteSmoke; color:black"
|AR-N8200.06
|LabSpin 2, 4000 rpm for 60s, softbake 10 min @ 150 degC, thickness is 120 nm
|Raith eLINE Plus, 30 kV, 60 µm aperture, 168 pA
|Labspin 2 hotplate 170 degC for 10 min
|EBL development fumehood, 60 sec development in AR300-47:DIW (1:1), 30 sec rinse in DIW, nitrogen gun dry
|-
|}
Area/curved element dose: Fully insoluble dose is around 150-180 µC/cm2.
Line dose: Fully insoluble dose is around 1700 pC/cm.
Dot dose: Fully insoluble dose is around 0.1 pC, this gives a circular diameter of 60 nm. Diameter can be varied by increasing dose, at 0.4 pC diameter is about 100 nm and at 1.2 pC it is about 170 nm.
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