Specific Process Knowledge/Lithography/ARP617: Difference between revisions
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Test of copolymer AR-P 617.05; a positive e-beam resist from AllResist. This copolymer is meant to be used as a sacrificial layer in a bi- or tri-layer e-beam resist stack (i.e. bottom layer). The copolymer adheres well on many substrates and can be dry-etched isotropically (to create under-cut) and anisotropically by reactive ion etch. Furthermore, it is softbaked at temperatures above 200 degrees and thus themally stable to many post-processing steps. | Test of copolymer AR-P 617.05; a positive e-beam resist from AllResist. This copolymer is meant to be used as a sacrificial layer in a bi- or tri-layer e-beam resist stack (i.e. bottom layer). The copolymer adheres well on many substrates and can be dry-etched isotropically (to create under-cut) and anisotropically by reactive ion etch. Furthermore, it is softbaked at temperatures above 200 degrees and thus themally stable to many post-processing steps. | ||
This is not a standard resist at Nanolab. | |||
== Spin Curve == | == Spin Curve == | ||
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[[File:SpinCurveARP617.jpg|right|500px]] | [[File:SpinCurveARP617.jpg|right|500px]] | ||
Please remember that a spin curve is only valid for that tool otherwise it acts as a guide for future tests. | |||
The thickness is measured on VASE Ellipsometer using a simple Cauchy model for a transparent polymer on Si. The measurements are performed at one incidence angle (70 degrees) only. | The thickness is measured on VASE Ellipsometer using a simple Cauchy model for a transparent polymer on Si. The measurements are performed at one incidence angle (70 degrees) only. | ||
Latest revision as of 11:16, 20 August 2021
Test of copolymer AR-P 617.05; a positive e-beam resist from AllResist. This copolymer is meant to be used as a sacrificial layer in a bi- or tri-layer e-beam resist stack (i.e. bottom layer). The copolymer adheres well on many substrates and can be dry-etched isotropically (to create under-cut) and anisotropically by reactive ion etch. Furthermore, it is softbaked at temperatures above 200 degrees and thus themally stable to many post-processing steps.
This is not a standard resist at Nanolab.
Spin Curve
Please remember that a spin curve is only valid for that tool otherwise it acts as a guide for future tests.
The thickness is measured on VASE Ellipsometer using a simple Cauchy model for a transparent polymer on Si. The measurements are performed at one incidence angle (70 degrees) only.
9 points on each 4" wafer has been measured; the standard deviation thus representing the homogeinity of the film on the 4" wafers.
| AllResist AR-P 617.05 spinning on Spin Coater: Manual LabSpin A-5, TIGRE, 13-06-2014 | ||||||
|---|---|---|---|---|---|---|
| Spin Speed [rpm] | Acceleration [1/s2] | Thickness [nm] | St Dev | |||
| 2000 | 2000 | 256.70 | 0.96 | |||
| 3000 | 2000 | 208.33 | 1.24 | |||
| 4000 | 2000 | 185.41 | 0.50 | |||
| 5000 | 2000 | 168.34 | 0.88 | |||
| 6000 | 2000 | 161.90 | 1.99 | |||