File:Air bubble.jpg: Difference between revisions

Latest revision as of 10:20, 26 June 2015

While electroplating in the 0-degree tilt position, air bubbles were caught in the system and were not able to escape. Consequently some areas on the wafer were not deposited with copper.

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	Date/Time	Thumbnail	Dimensions	User	Comment
current	10:19, 26 June 2015		861 × 661 (154 KB)	Lynhen (talk \| contribs)	While electroplating in the 0-degree tilt position, air bubbles were caught in the system and were not able to escape.

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Camera manufacturer	Canon
Camera model	Canon IXUS 265 HS
Exposure time	1/30 sec (0.033333333333333)
F Number	f/3.6
ISO speed rating	125
Date and time of data generation	14:59, 15 June 2015
Lens focal length	4.5 mm
Orientation	Normal
Horizontal resolution	180 dpi
Vertical resolution	180 dpi
File change date and time	14:59, 15 June 2015
Y and C positioning	Co-sited
Exif version	2.3
Date and time of digitizing	14:59, 15 June 2015
Meaning of each component	Y Cb Cr does not exist
Image compression mode	3
APEX shutter speed	4.90625
APEX aperture	3.6875
APEX exposure bias	0
Maximum land aperture	3.6875 APEX (f/3.59)
Metering mode	Pattern
Flash	Flash did not fire, compulsory flash suppression
Supported Flashpix version	1
Color space	sRGB
Focal plane X resolution	18,962.962962963
Focal plane Y resolution	18,989.010989011
Focal plane resolution unit	inches
Sensing method	One-chip color area sensor
File source	Digital still camera
Custom image processing	Normal process
Exposure mode	Auto exposure
White balance	Auto white balance
Digital zoom ratio	1
Scene capture type	Standard
GPS tag version	2.3.0.0
Rating (out of 5)	0

Revision as of 10:19, 26 June 2015 view source Lynhen (talk \| contribs) DCH-Employees-701 52 edits While electroplating in the 0-degree tilt position, air bubbles were caught in the system and were not able to escape.		Latest revision as of 10:20, 26 June 2015 view source Lynhen (talk \| contribs) DCH-Employees-701 52 edits No edit summary
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	While electroplating in the 0-degree tilt position, air bubbles were caught in the system and were not able to escape.		While electroplating in the 0-degree tilt position, air bubbles were caught in the system and were not able to escape. Consequently some areas on the wafer were not deposited with copper.