Specific Process Knowledge/Wafer cleaning/IMEC: Revision history

1 February 2023

• curprev 11:0711:07, 1 February 2023‎ Mbec talk contribs‎ 4,355 bytes +155‎ No edit summary

25 November 2019

• curprev 13:5613:56, 25 November 2019‎ Jmli talk contribs‎ 4,200 bytes 0‎ →‎The IMEC process: Cleaning of wafers prior to fusion bonding
• curprev 13:5613:56, 25 November 2019‎ Jmli talk contribs‎ 4,200 bytes 0‎ →‎The IMEC process: Cleaning of wafers prior to fusion bonding
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• curprev 13:1713:17, 25 November 2019‎ Jmli talk contribs‎ 4,998 bytes −48‎ →‎The IMEC process: Cleaning of wafers prior to fusion bonding
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19 May 2017

• curprev 10:3010:30, 19 May 2017‎ Choi talk contribs‎ 4,248 bytes −1‎ →‎The IMEC process: Cleaning of wafers prior to fusion bonding
• curprev 10:2910:29, 19 May 2017‎ Choi talk contribs‎ 4,249 bytes +17‎ →‎The IMEC process: Cleaning of wafers prior to fusion bonding
• curprev 10:2810:28, 19 May 2017‎ Choi talk contribs‎ 4,232 bytes +22‎ /* Please note: This elaborate cleaning method is only used very rarely. It has turned out that at DTU Danchip an 'RCA clean' prior to bonding (and doing cleaning and bonding very early in the morning with few people and thus lower particle level)...
• curprev 10:2710:27, 19 May 2017‎ Choi talk contribs‎ 4,210 bytes −2‎ No edit summary
• curprev 10:0910:09, 19 May 2017‎ Choi talk contribs‎ 4,212 bytes −27‎ /* Please note: This elaborate cleaning method is only used very rarely. It has turned out that at DTU Danchip an 'RCA clean' prior to bonding (and doing the cleaning as well as the bonding very early in the morning with very few people in the cle...
• curprev 10:0710:07, 19 May 2017‎ Choi talk contribs‎ 4,239 bytes +580‎ →‎The IMEC process is used for cleaning of wafers prior to fusion bonding
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18 May 2017

• curprev 13:5513:55, 18 May 2017‎ Choi talk contribs‎ 2,649 bytes +176‎ →‎The IMEC process is used for cleaning of wafers prior to fusion bonding
• curprev 13:4713:47, 18 May 2017‎ Choi talk contribs‎ 2,473 bytes +164‎ No edit summary
• curprev 13:4313:43, 18 May 2017‎ Choi talk contribs‎ 2,309 bytes +35‎ →‎IMEC process for cleaning of wafers before fusion bonding:

17 November 2014

• curprev 13:3813:38, 17 November 2014‎ Kabi talk contribs‎ 2,274 bytes +1‎ →‎IMEC process for cleaning of wafers before fusion bonding:

3 March 2014

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• curprev 11:4711:47, 3 March 2014‎ Kabi talk contribs‎ 2,265 bytes +293‎ No edit summary
• curprev 10:3910:39, 3 March 2014‎ Kabi talk contribs‎ 1,972 bytes +2‎ →‎IMEC process for cleaning of wafers before fusion bonding:

21 October 2013

• curprev 15:0215:02, 21 October 2013‎ Kabi talk contribs‎ 1,970 bytes +210‎ No edit summary

19 December 2012

• curprev 10:1210:12, 19 December 2012‎ Kb talk contribs‎ 1,760 bytes −4‎ →‎IMEC process for cleaning of wafers before fusion bonding:

19 October 2012

• curprev 07:0807:08, 19 October 2012‎ BGE talk contribs‎ 1,764 bytes −8‎ →‎IMEC process for cleaning of wafers before fusion bonding:
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14 March 2008

• curprev 13:4413:44, 14 March 2008‎ BGE talk contribs‎ 1,800 bytes +1‎ →‎IMEC process for cleaning of wafers before fusion bonding:
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25 February 2008

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• curprev 12:0212:02, 25 February 2008‎ BGE talk contribs‎ 1,629 bytes +189‎ →‎IMEC process for cleaning of wafers before fusion bonding:

11 February 2008

• curprev 11:0511:05, 11 February 2008‎ 192.38.87.73 talk‎ 1,440 bytes −15‎ No edit summary
• curprev 11:0411:04, 11 February 2008‎ 192.38.87.73 talk‎ 1,455 bytes −236‎ →‎IMEC process for cleaning of wafers before fusion bonding:
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15 January 2008

• curprev 08:4308:43, 15 January 2008‎ BGE talk contribs‎ 1,576 bytes +29‎ →‎IMEC process for cleaning of wafers before fusion bonding:

22 October 2007

• curprev 09:1209:12, 22 October 2007‎ 192.38.87.73 talk‎ 1,547 bytes +15‎ No edit summary
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• curprev 07:3707:37, 22 October 2007‎ 192.38.87.76 talk‎ 1,526 bytes +62‎ No edit summary
• curprev 07:3507:35, 22 October 2007‎ 192.38.87.76 talk‎ 1,464 bytes +1,464‎ New page: {| border="1" cellspacing="0" cellpadding="5" align="center" ! Step ! Process ! Details !Comments !Comments |- | 4.0 | Pre bonding cleaning of Si wafers with cavities and SOI wafers with ...