Specific Process Knowledge/Thin film deposition/ALD2 (PEALD)/TiN plasma deposition using ALD2: Revision history

5 October 2026

• curprev 18:5818:58, 5 October 2026 Eves talk contribs 15,222 bytes +2 →TiN plasma Nanolab Standard
• curprev 18:5618:56, 5 October 2026 Eves talk contribs 15,220 bytes +31 →TiN plasma Nanolab Standard
• curprev 18:5418:54, 5 October 2026 Eves talk contribs 15,189 bytes +474 →TiN plasma Nanolab Standard
• curprev 18:5118:51, 5 October 2026 Eves talk contribs 14,715 bytes +12 →TiN plasma Nanolab Standard
• curprev 17:5417:54, 5 October 2026 Eves talk contribs 14,703 bytes 0 →X-ray photoelectron spectroscopy
• curprev 17:5317:53, 5 October 2026 Eves talk contribs 14,703 bytes 0 →Spectroscopic Ellipsometry
• curprev 17:5217:52, 5 October 2026 Eves talk contribs 14,703 bytes 0 →Uniformity across 150 mm wafer
• curprev 17:5117:51, 5 October 2026 Eves talk contribs 14,703 bytes +6 →TiN ALD deposition using TiCl4 and NH3
• curprev 17:1817:18, 5 October 2026 Eves talk contribs 14,697 bytes +14,697 Created page with " <i>This page is written by <b>Evgeniy Shkondin @DTU Nanolab</b> if nothing else is stated. <br> All images and photos on this page belongs to <b>DTU Nanolab</b>.<br> The fabrication and characterization described below were conducted in <b>2021 by Evgeniy Shkondin, DTU Nanolab</b>.<br></i> Deposition of TiN is a standard, well explored ALD process. In any book where ALD is explained or scientific reviews on a subject, the TiN process is mentioned as a standard example..."