Specific Process Knowledge/Lithography/Pretreatment/Oven 250C: Revision history

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7 February 2023

  • curprev 12:3912:39, 7 February 2023‎ Jehem talk contribs‎ 617 bytes +617‎ Created page with "=Oven 250C= 300x300px|thumb|Oven 250C for pretreatment in Cx-1 The oven is typically used for dehydration pretreatment, of Si and glass substrates, to promote the resist adhesion. We recommend placing the wafers in a metal carrier in the oven for at least for 4 hours, or overnight, and spin coat resist on them as soon as possible after removing them from the oven. The user manual, and contact information can be found..."
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