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Specific Process Knowledge/Lithography/Descum/plasmaAsher04: Revision history

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12 January 2026

  • curprev 15:2615:26, 12 January 2026 Jehem talk contribs 5,878 bytes −3 →Comparison of ashing rate between substrate sizes
  • curprev 11:1411:14, 12 January 2026 Jehem talk contribs 5,881 bytes +5,881 Created page with "=Plasma Asher 4= Product name: PVA Tepla Gigabatch 380M<br> Year of purchase: 2024 Descum of AZ 5214E on 100 mm wafers. The descum process development was done for a single substrate, as well as 3 substrates (for decreased ashing rate and improved ashing uniformity). The substrates were placed vertically in the glass boat. <gallery style="text-align: center;" widths=250 heights=250> PA_boat_1Wafer_v2.png|Single vertical substrate PA_boat_3Wafer_v2.png|3 vertical substr..."
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