Specific Process Knowledge/Etch/Etching of Silicon Oxide/SiO2 etch using AOE: Revision history

1 February 2023

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31 January 2023

• curprev 14:1514:15, 31 January 2023‎ Bghe talk contribs‎ 11,501 bytes +34‎ →‎QC on the AOE
• curprev 14:1414:14, 31 January 2023‎ Bghe talk contribs‎ 11,467 bytes +89‎ No edit summary

29 August 2022

• curprev 14:2014:20, 29 August 2022‎ Bghe talk contribs‎ 11,378 bytes +15‎ →‎What masking material should I choose when etching SiO2/glass in the AOE?
• curprev 14:1914:19, 29 August 2022‎ Bghe talk contribs‎ 11,363 bytes +132‎ →‎What masking material should I choose when etching SiO2/glass in the AOE?
• curprev 14:1714:17, 29 August 2022‎ Bghe talk contribs‎ 11,231 bytes +29‎ →‎What masking material should I choose when etching SiO2/glass in the AOE?

19 March 2020

• curprev 09:5509:55, 19 March 2020‎ Bghe talk contribs‎ 11,202 bytes +8‎ →‎QC on the AOE

16 March 2020

• curprev 15:5515:55, 16 March 2020‎ Bghe talk contribs‎ 11,194 bytes −11‎ →‎QC on the AOE

13 March 2020

• curprev 09:4009:40, 13 March 2020‎ Bghe talk contribs‎ 11,205 bytes −26‎ No edit summary
• curprev 09:3309:33, 13 March 2020‎ Bghe talk contribs‎ 11,231 bytes +27‎ →‎What masking material should I choose when etching SiO2/glass in the AOE?

21 February 2020

• curprev 14:2814:28, 21 February 2020‎ Pevo talk contribs‎ 11,204 bytes +14‎ →‎What masking material should I choose when etching SiO2/glass in the AOE?

25 November 2019

• curprev 15:2415:24, 25 November 2019‎ Jmli talk contribs‎ 11,190 bytes 0‎ No edit summary
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28 January 2019

• curprev 10:0510:05, 28 January 2019‎ Bghe talk contribs‎ 11,210 bytes −4‎ →‎What masking material should I choose when etching SiO2/glass in the AOE?
• curprev 10:0410:04, 28 January 2019‎ Bghe talk contribs‎ 11,214 bytes 0‎ →‎What masking material should I choose when etching SiO2/glass in the AOE?

13 January 2017

• curprev 13:4213:42, 13 January 2017‎ Bghe talk contribs‎ 11,214 bytes +124‎ →‎Etching SiO2 with hard mask (metal or dielectrics)
• curprev 13:3813:38, 13 January 2017‎ Bghe talk contribs‎ 11,090 bytes +360‎ No edit summary

29 February 2016

• curprev 09:5809:58, 29 February 2016‎ Bghe talk contribs‎ 10,730 bytes +38‎ No edit summary
• curprev 09:5309:53, 29 February 2016‎ Bghe talk contribs‎ 10,692 bytes +72‎ No edit summary
• curprev 09:4609:46, 29 February 2016‎ Bghe talk contribs‎ 10,620 bytes 0‎ →‎What masking material should I choose when etching SiO2/glass in the AOE?
• curprev 09:4409:44, 29 February 2016‎ Bghe talk contribs‎ 10,620 bytes +216‎ →‎What masking material should I choose when etching SiO2/glass in the AOE?

25 November 2015

• curprev 10:3410:34, 25 November 2015‎ Bghe talk contribs‎ 10,404 bytes +140‎ →‎What masking material should I choose when etching SiO2/glass in the AOE?

24 November 2015

• curprev 10:1310:13, 24 November 2015‎ Bghe talk contribs‎ 10,264 bytes 0‎ →‎Standard silicon oxide etch using resist as masking material
• curprev 10:1310:13, 24 November 2015‎ Bghe talk contribs‎ 10,264 bytes +12‎ →‎Standard silicon oxide etch using resist as masking material
• curprev 10:1210:12, 24 November 2015‎ Bghe talk contribs‎ 10,252 bytes +4‎ →‎Standard silicon oxide etch using resist as masking material
• curprev 10:1210:12, 24 November 2015‎ Bghe talk contribs‎ 10,248 bytes +29‎ →‎Standard silicon oxide etch using resist as masking material
• curprev 10:1110:11, 24 November 2015‎ Bghe talk contribs‎ 10,219 bytes −68‎ →‎Etching of micro structures in Silicon Oxide with resist as masking material
• curprev 09:3209:32, 24 November 2015‎ Bghe talk contribs‎ 10,287 bytes 0‎ →‎Etching of micro structures in Silicon Oxide with PolySi as masking material
• curprev 09:3209:32, 24 November 2015‎ Bghe talk contribs‎ 10,287 bytes −5‎ →‎Etching of micro structures in Silicon Oxide with PolySi as masking material
• curprev 09:3109:31, 24 November 2015‎ Bghe talk contribs‎ 10,292 bytes +78‎ →‎Etching of micro structures in Silicon Oxide with PolySi as masking material
• curprev 09:2809:28, 24 November 2015‎ Bghe talk contribs‎ 10,214 bytes −4,073‎ →‎Etching of micro structures in Aluminum oxide
• curprev 09:2609:26, 24 November 2015‎ Bghe talk contribs‎ 14,287 bytes −12‎ →‎Standard silicon oxide etch using resist as masking material
• curprev 09:2609:26, 24 November 2015‎ Bghe talk contribs‎ 14,299 bytes +3‎ →‎Standard silicon oxide etch using resist as masking material
• curprev 09:2509:25, 24 November 2015‎ Bghe talk contribs‎ 14,296 bytes −1,074‎ →‎High selectivity to Si-mask recipe
• curprev 09:2509:25, 24 November 2015‎ Bghe talk contribs‎ 15,370 bytes −1,074‎ →‎High selectivity to Si-mask recipe
• curprev 09:2409:24, 24 November 2015‎ Bghe talk contribs‎ 16,444 bytes −1,074‎ →‎High selectivity to Si-mask recipe
• curprev 09:2409:24, 24 November 2015‎ Bghe talk contribs‎ 17,518 bytes −1,067‎ →‎Good wafer uniformity recipe
• curprev 09:2309:23, 24 November 2015‎ Bghe talk contribs‎ 18,585 bytes −1,118‎ →‎Low line width reduction recipe
• curprev 09:2209:22, 24 November 2015‎ Bghe talk contribs‎ 19,703 bytes −1,015‎ →‎High etch rate recipe
• curprev 09:1709:17, 24 November 2015‎ Bghe talk contribs‎ 20,718 bytes 0‎ →‎Etching of micro structures in Silicon Oxide with PolySi as masking material
• curprev 09:1609:16, 24 November 2015‎ Bghe talk contribs‎ 20,718 bytes +1,074‎ →‎Etching of micro structures in Silicon Oxide with PolySi as masking material
• curprev 09:1409:14, 24 November 2015‎ Bghe talk contribs‎ 19,644 bytes +1,074‎ →‎Etching of micro structures in Silicon Oxide with PolySi as masking material
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• curprev 09:0809:08, 24 November 2015‎ Bghe talk contribs‎ 18,826 bytes +6‎ →‎Standard silicon oxide etch using resist as masking material

19 November 2015

• curprev 12:0712:07, 19 November 2015‎ Bghe talk contribs‎ 18,820 bytes −8‎ →‎Standard silicon oxide etch using resist as masking material
• curprev 12:0612:06, 19 November 2015‎ Bghe talk contribs‎ 18,828 bytes +2‎ →‎Etching with CSAR resist as masking material
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• curprev 12:0512:05, 19 November 2015‎ Bghe talk contribs‎ 19,861 bytes +47‎ →‎Etching with CSAR resist
• curprev 12:0312:03, 19 November 2015‎ Bghe talk contribs‎ 19,814 bytes +8‎ →‎Slow etch of SiO2 with resist as masking material - for use with carrier
• curprev 12:0312:03, 19 November 2015‎ Bghe talk contribs‎ 19,806 bytes −2,060‎ →‎Slow etch of SiO2 with resist as masking material - to be used with 150mm Si carrier wafer