Specific Process Knowledge/Etch/DRIE-Pegasus/FAQ/Bonding: Revision history

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25 February 2011

• curprev 11:1911:19, 25 February 2011‎ Jml talk contribs‎ 1,238 bytes +1,238‎ New page: ; Question 1 : A user tried to etch through a wafer using a carrier and crystalbond as medium (see image below). Even though he ran the standard SPTS process (with 14 % etch load) at 0 deg...