File:WF 2E02 mar23 2011-120.jpg: Revision history

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7 April 2011

  • curprev 15:1815:18, 7 April 2011‎ Jml talk contribs‎ 257 bytes +257‎ The profiles of the 211 nm thick zep resist wafers (The E-batch of march 23 2011). The wafers have been over-exposed in the E-beam (400 µC/cm2) to make sure that all structures are opened - therefore the 30, 60, 90, 120 and 150 nm lines are somewhat wide
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