Specific Process Knowledge/Characterization/Stress measurement: Revision history

31 January 2008

• curprev 14:2014:20, 31 January 2008 BGE talk contribs 2,076 bytes +7 →When deposition on both sides of the wafer
• curprev 14:2014:20, 31 January 2008 BGE talk contribs 2,069 bytes +7 →When deposition on one side of the wafer
• curprev 14:1914:19, 31 January 2008 BGE talk contribs 2,062 bytes −10 No edit summary
• curprev 14:1914:19, 31 January 2008 BGE talk contribs 2,072 bytes +6 No edit summary

5 November 2007

• curprev 14:2514:25, 5 November 2007 BGE talk contribs 2,066 bytes +971 No edit summary
• curprev 14:2114:21, 5 November 2007 BGE talk contribs 1,095 bytes 0 No edit summary
• curprev 14:2014:20, 5 November 2007 BGE talk contribs 1,095 bytes +39 No edit summary
• curprev 14:1814:18, 5 November 2007 BGE talk contribs 1,056 bytes +70 No edit summary

1 November 2007

• curprev 15:2415:24, 1 November 2007 BGE talk contribs 986 bytes +986 New page: Stress measurements of a thin film can be done measuring the wafer bow before and after deposition of the film. If the film is deposited on both sides of the wafer you can measure the bow ...