Specific Process Knowledge/Thin film deposition/Deposition of Gold/Adhesion layers: Revision history

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14 August 2018

30 July 2018

20 July 2018

  • curprev 13:0513:05, 20 July 2018Mattod talk contribs 533 bytes +533 Created page with "allic bond with gold. 5 nm to 10 nm thick of Cr or Ti is commonly used and it is important to deposit Cr or Ti and then immediately Au. If the vacuum chamber is opened in betw..."
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