View source for Specific Process Knowledge/Lithography/ARN8200

== AR-N 8200 ==

AR-N 8200 is a negative E-beam resist from Allresist, it is also known as "Medusa 82". A product presentation from Allresist is available here [https://www.allresist.com/wp-content/uploads/sites/2/2020/10/Medusa82_presentation-2020.pdf AR-N8200 presentation.]

Allresist also provides these [https://www.allresist.com/wp-content/uploads/sites/2/2020/03/SXAR-N8200-1_english_Allresist_product_information.pdf processing guidelines.]

== Contrast curve @ 100 kV (JEOL 9500) ==

Exposure dose for AR-N 8200 is very dependent on Post Exposure Bake (PEB) temperature. A contrast curve for four different PEB processes were obtained with the following process parameters.


{|border="1" cellspacing="0" cellpadding="3" style="text-align:left;"  style="width: 95%"
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|-style="background:Black; color:White"
!colspan="5"|AR-N 8200 Contrast Curve, Processed by THOPE, FEB 2022
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|-style="background:WhiteSmoke; color:black"
!Resist
!Spin Coat
!E-beam exposure
!PEB
!Development
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|-style="background:WhiteSmoke; color:black"
|AR-N8200.06
|LabSpin 2, 4000 rpm for 60s, softbake 10 min @ 150 degC, thickness is 110 nm
|JBX9500, 60 nA, doses 100-1600 µC/cm2, 150 µm x 300 µm rectangles
|Labspin 2 hotplate, 130, 150, 160 or 170 degC for 10 min
|EBL development fumehood, 60 sec development in AR300-47:DIW (1:1), 30 sec rinse in DIW, nitrogen gun dry
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Hotplate temperatures are assumed surface temperatures based on the 0.90 correction factor in use on the hotplate.


The resulting resist structure height is mapped with Dektak XTa and plotted as a contrast curve below. It is apparent that the dose and contrast is very dependent on the PEB parameters.


[[file:ARN8200DoseCurve.png]]

== Results at 30 kV (Raith eLINE) ==

A dose test is carried out with the following parameters

{|border="1" cellspacing="0" cellpadding="3" style="text-align:left;"  style="width: 95%"
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|-style="background:Black; color:White"
!colspan="5"|AR-N 8200 30 kV dose test, Processed by THOPE, AUG 2022
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|-style="background:WhiteSmoke; color:black"
!Resist
!Spin Coat
!E-beam exposure
!PEB
!Development
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|-
|-style="background:WhiteSmoke; color:black"
|AR-N8200.06
|LabSpin 2, 4000 rpm for 60s, softbake 10 min @ 150 degC, thickness is 120 nm
|Raith eLINE Plus, 30 kV, 60 µm aperture, 168 pA
|Labspin 2 hotplate 170 degC for 10 min
|EBL development fumehood, 60 sec development in AR300-47:DIW (1:1), 30 sec rinse in DIW, nitrogen gun dry
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Area/curved element dose: Fully insoluble dose is around 150-180 µC/cm2.

Line dose: Fully insoluble dose is around 1700 pC/cm.

Dot dose: Fully insoluble dose is around 0.1 pC, this gives a circular diameter of 60 nm. Diameter can be varied by increasing dose, at 0.4 pC diameter is about 100 nm and at 1.2 pC it is about 170 nm.