View source for Specific Process Knowledge/Etch/DRIE-Pegasus/DREM/DREM 3kW 100% a

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{| border="2" cellpadding="0" cellspacing="0" style="text-align:center;"
|-
! rowspan="2" width="40"| Date
! colspan="2" width="120"| Substrate Information
! colspan="4" | Process Information
! colspan="3" width="200" | Results
|-
! width="30" | Wafer info
! width="40" | Material/ Exposed area
! width="40" | Condi- tioning
! width="40" | Recipe
! width="40" | Wafer ID
! width="40" | Comments
! width="400" |SEM images
! width="400" |Picoscope 
! width="400" |Numbers 
|-
|29/11-2019
|Medusa One
|Si /  10%
|stab-19 chamber clean 20
|nanolab/ jmli /DREM 3.0 kW 100% a
|S018652
|[http://labmanager.dtu.dk/function.php?module=Processlog&view=editlog&usageid=340452 Process log entry]
| 
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{| {{table}} 
| align="center" style="background:#f0f0f0;"|'''SEM image:'''
| align="center" style="background:#f0f0f0;"|'''[http://labadviser.nanolab.dtu.dk/index.php/File:S018652a000.png a000]'''
| align="center" style="background:#f0f0f0;"|'''[http://labadviser.nanolab.dtu.dk/index.php/File:S018652a001.png a001]'''
| align="center" style="background:#f0f0f0;"|'''[http://labadviser.nanolab.dtu.dk/index.php/File:S018652a002.png a002]'''
| align="center" style="background:#f0f0f0;"|'''[http://labadviser.nanolab.dtu.dk/index.php/File:S018652a003.png a003]'''
| align="center" style="background:#f0f0f0;"|'''[http://labadviser.nanolab.dtu.dk/index.php/File:S018652a004.png a004]'''
| align="center" style="background:#f0f0f0;"|'''[http://labadviser.nanolab.dtu.dk/index.php/File:S018652a005.png a005]'''
| align="center" style="background:#f0f0f0;"|'''[http://labadviser.nanolab.dtu.dk/index.php/File:S018652a006.png a006]'''
| align="center" style="background:#f0f0f0;"|'''[http://labadviser.nanolab.dtu.dk/index.php/File:S018652a007.png a007]'''
| align="center" style="background:#f0f0f0;"|'''[http://labadviser.nanolab.dtu.dk/index.php/File:S018652a008.png a008]'''
| align="center" style="background:#f0f0f0;"|'''[http://labadviser.nanolab.dtu.dk/index.php/File:S018652a009.png a009]'''
|- 
| Trench width (um)||400.14||400.65||249.77||161.15||81.37||41.79||20.28||9.84||4.27||2.71
|- 
| Etched depth (um)||140.42||140.43||141.5||141.57||135.57||124.71||108.95||91.98||70.41||60.74
|- 
| Etch rate (um/min)||14.04||14.04||14.15||14.16||13.56||12.47||10.89||9.2||7.04||6.07
|- 
| <span title="The cycles will vary if the aspect ratio is large "> Etch rate (nm/cyc) </span>||1.17||1.17||1.18||1.18||1.13||1.04||0.91||0.77||0.59||0.51
|- 
| Sidewall bowing (%)||-0.36||-0.8||-0.45||-0.31||-0.14||-0.04||0.28||0.64||0.44||0.76
|- 
| Sidewall angle (degs)||93.28||93.18||93.1||92.33||91.82||91.58||91.53||91.37||91.12||90.66
|- 
| Bottom bowing (%)||3.39||3.99||5.43||8.68||13.13||16.86||18.26||13.09||16.07||18.41
|- 
|Aspect ratio||0.34||0.34||0.55||0.85||1.58||2.76||4.7||7.64||12.46||17.77
|- 
|}
|- 
|}