View source for Specific Process Knowledge/Etch/ICP Metal Etcher/silicon/nano/Sinan332

== The Sinano3.32 recipe ==

{| border="2" cellpadding="2" cellspacing="1" 
|+ '''Recipe Sinano3.32'''
|-
! rowspan="6" align="center"| Recipe
| Gas
| BCl<sub>3</sub> 5 sccm, HBR 15 sccm
|-
| Pressure
| 2 mTorr, Strike 3 secs @ 5 mTorr
|-
| Power
| 900 W CP, 30 W PP
|- 
| Temperature
| 50 degs
|-
| Hardware
| 100 mm Spacers
|-
| Time
| 60, 120 and 180 secs
|-
! rowspan="5" align="center"| Conditions
| Run ID
| 465, 466 and 467
|-
| Conditioning
| Sequence: Oxygen clean, MU tests, processes, no oxygen between runs
|-
| Mask
| 211 nm zep 
|- 
|}

<gallery caption="The results of the Sinano3.32 recipe" widths="250" heights="200" perrow="5">
image:WF_2E05_mar23_2011-030a.jpg|The 30 nm trenches etched 60 seconds
image:WF_2E05_mar23_2011-060a.jpg|The 60 nm trenches etched 60 seconds
image:WF_2E05_mar23_2011-090a.jpg|The 90 nm trenches etched 60 seconds
image:WF_2E05_mar23_2011-120a.jpg|The 120 nm trenches etched 60 seconds
image:WF_2E05_mar23_2011-150a.jpg|The 150 nm trenches etched 60 seconds

image:WF_2E05_mar23_2011-030b.jpg|The 30 nm trenches etched 120 seconds
image:WF_2E05_mar23_2011-060b.jpg|The 60 nm trenches etched 120 seconds
image:WF_2E05_mar23_2011-090b.jpg|The 90 nm trenches etched 120 seconds
image:WF_2E05_mar23_2011-120b.jpg|The 120 nm trenches etched 120 seconds
image:WF_2E05_mar23_2011-150b.jpg|The 150 nm trenches etched 120 seconds

image:WF_2E05_mar23_2011-030c.jpg|The 30 nm trenches etched 180 seconds
image:WF_2E05_mar23_2011-060c.jpg|The 60 nm trenches etched 180 seconds
image:WF_2E05_mar23_2011-090c.jpg|The 90 nm trenches etched 180 seconds
image:WF_2E05_mar23_2011-120c.jpg|The 120 nm trenches etched 180 seconds
image:WF_2E05_mar23_2011-150c.jpg|The 150 nm trenches etched 180 seconds

</gallery>


{| {{table}}
|+ After 60 seconds
| align="center" style="background:#f0f0f0;"|'''Nominal trench line width'''
| align="center" style="background:#f0f0f0;"|''''''
| align="center" style="background:#f0f0f0;"|'''30'''
| align="center" style="background:#f0f0f0;"|'''60'''
| align="center" style="background:#f0f0f0;"|'''90'''
| align="center" style="background:#f0f0f0;"|'''120'''
| align="center" style="background:#f0f0f0;"|'''150'''
| align="center" style="background:#f0f0f0;"|'''Average'''
| align="center" style="background:#f0f0f0;"|'''Std. dev.'''
|-
| Etch rate||nm/min||44||57||59||64||63||57||8
|-
| Sidewall angle||degs||73||74||76||78||73||75||2
|-
| CD loss||nm/edge||-4||-15||-14||-12||-32||-15||10
|-
| CD loss foot||nm/edge||1||-1||0||-1||-4||-1||2
|-
| Bowing||||4||6||1||6||1||4||2
|-
| Bottom curvature||||-14||-9||-5||-1||-1||-6||5
|-
| Zep etch rate||nm/min||||||||||||33||
|-
| 
|}


{| {{table}}
|+ After 120 seconds
| align="center" style="background:#f0f0f0;"|'''Nominal trench line width'''
| align="center" style="background:#f0f0f0;"|''''''
| align="center" style="background:#f0f0f0;"|'''30'''
| align="center" style="background:#f0f0f0;"|'''60'''
| align="center" style="background:#f0f0f0;"|'''90'''
| align="center" style="background:#f0f0f0;"|'''120'''
| align="center" style="background:#f0f0f0;"|'''150'''
| align="center" style="background:#f0f0f0;"|'''Average'''
| align="center" style="background:#f0f0f0;"|'''Std. dev.'''
|-
| Etch rate||nm/min||48||60||67||69||71||63||9
|-
| Sidewall angle||degs||78||78||76||75||75||76||1
|-
| CD loss||nm/edge||-1||-12||-15||-13||-30||-14||10
|-
| CD loss foot||nm/edge||5||1||-1||-1||-3||0||3
|-
| Bowing||||7||8||16||20||19||14||6
|-
| Bottom curvature||||-22||-12||6||8||5||-3||13
|-
| Zep etch rate||nm/min||||||||||||22||
|-
| 
|}


{| {{table}}
|+ After 180 seconds
| align="center" style="background:#f0f0f0;"|'''Nominal trench line width'''
| align="center" style="background:#f0f0f0;"|''''''
| align="center" style="background:#f0f0f0;"|'''30'''
| align="center" style="background:#f0f0f0;"|'''60'''
| align="center" style="background:#f0f0f0;"|'''90'''
| align="center" style="background:#f0f0f0;"|'''150'''
| align="center" style="background:#f0f0f0;"|'''Average'''
| align="center" style="background:#f0f0f0;"|'''Std. dev.'''
|-
| Etch rate||nm/min||43||59||65||70||59||12
|-
| Sidewall angle||degs||82||80||79||77||79||2
|-
| CD loss||nm/edge||-5||-16||-18||-30||-17||10
|-
| CD loss foot||nm/edge||1||-3||-4||-3||-2||2
|-
| Bowing||||9||19||24||31||21||9
|-
| Bottom curvature||||-30||-16||-8||13||-10||18
|-
| Zep etch rate||nm/min||||||||||19||
|-
| 
|}