View source for Specific Process Knowledge/Etch/DRIE-Pegasus/nanoetch/nano10

== The nano1.0 recipe ==
<!--foo-->
{| border="2" cellpadding="2" cellspacing="1" 
|+ '''Recipe nano1.0'''
|-
! rowspan="6" align="center"| Recipe
| Gas
| C<sub>4</sub>F<sub>8</sub> 38 sccm, SF<sub>6</sub> 52 sccm
|-
| Pressure
| 4 mTorr, Strike 3 secs @ 15 mTorr
|-
| Power
| 800 W CP, 50 W PP
|- 
| Temperature
| 10 degs
|-
| Hardware
| 100 mm Spacers
|-
| Time
| 120 secs
|-
! rowspan="3" align="center"| Conditions
| Run ID
| 1801
|-
| Conditioning
| Sequence: Oxygen clean, MU tests, processes, no oxygen between runs
|-
| Mask
| 1dfhj10 nm zep etched down to 6dgh4 nm
|- 
|}


<gallery caption="The results of the nano1.0 recipe" widths="250" heights="200" perrow="3">
image:WF_2C3feb2011-030.jpg|The 30 nm trenches
image:WF_2C3feb2011-060.jpg|The 60 nm trenches
image:WF_2C3feb2011-090.jpg|The 90 nm trenches
image:WF_2C3feb2011-120.jpg|The 120 nm trenches
image:WF_2C3feb2011-150.jpg|The 150 nm trenches
C4F8 52 sccm, SF6 38 sccm, 4 mTorr, Strike 3 secs @ 15 mTorr, 800 W CP, 50 W PP, 10 degs, 120 secs
</gallery>

== Comments ==

The process looks to be too etch aggressive, not enough passivation.  Consider any or all of the following: 
* Decreasing the wafer temperature (make more passivant)
* Increasing C4F8 flow (make more passivant)
* Increasing platen power (make more directional)
* Decreasing coil power (make less etch-aggressive and more directional.

Also, if the tool has Short Funnel and 5mm spacers fitted, it may be too close to  the plasma  -  previous good nano-scale etch result was achieved with Long Funnel and 100mm spacers.

The conditions are similar to the nano-etch conditions for acceptance process C:
{| border="2" cellpadding="2" cellspacing="1"
|-
|
| Etch 
|-
| Gas Flow (sccm)
| SF<sub>6</sub>  38 + '''C<sub>4</sub>F<sub>8</sub> 70'''
|-
| Pressure (mT)
| 4 
|-
| APC angle (%)
| 33.2 
|- 
| Coil power (W)
| '''450''' 
|-
| Matching (Forward/ Load)
| L/ 33 & T/ 43 
|-
| HF Platen power (W)
| '''100''' 
|- 
| Matching (Forward/ Load) 
| L/ 49 & T/ 53 
|- 
| Time
| 01:30 
|-
| Hardware configuration
| 150mm Long  funnel, with baffle & 100mm spacers 
|-
| APC Gain
| 7.5 (default) 
|-
| Platen Temperature
| 10°C
|}

The highlighted sections are the main differences between the Process C conditions Vs new Imprint Trenches conditions: all of the changes would push the process to be more passivant, less etch aggressive and more directional.

Is there any reason why these conditions are not suitable for the Imprint Trenches etch?