View source for Specific Process Knowledge/Etch/DRIE-Pegasus/Pegasus-3/DREM/DREM 0.5kW v2.3

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{| border="2" cellpadding="0" cellspacing="0" style="text-align:center;"
|-
! rowspan="2" width="40"| Date
! colspan="2" width="120"| Substrate Information
! colspan="4" | Process Information
! colspan="3" width="200" | Results
|-
! width="30" | Wafer info
! width="40" | Material/ Exposed area
! width="40" | Condi- tioning
! width="40" | Recipe
! width="40" | Wafer ID
! width="40" | Comments
! width="400" |SEM images
! width="100" |Picoscope 
! width="600" |Numbers 
|-
|16/6-2021
|150 mm wafer with standard DUV resist and PegReticle pattern
|Si /  25-50%
|C06692.03 pegreticle wafer
|nanolab/ jmli / DREM / DREM 0.5kW v2.3, 50 cycles or 4:35 minutes
|C06694.01
|[http://labmanager.dtu.dk/function.php?module=Processlog&view=editlog&usageid=388881 Process log entry]
| 
[[file:C06694.01c153.png |120px|frameless ]]
[[file:C06694.01c154.png |120px|frameless ]]
[[file:C06694.01c155.png |120px|frameless ]]
[[file:C06694.01c156.png |120px|frameless ]]
[[file:C06694.01c157.png |120px|frameless ]]
[[file:C06694.01c158.png |120px|frameless ]]
| <!-- Add picos here:[[file:S014009 1.gif |120px|frameless ]] -->
| 
{| {{table}} 
| align="center" style="background:#f0f0f0;"|'''SEM image:'''
| align="center" style="background:#f0f0f0;"|'''[http://labadviser.nanolab.dtu.dk/index.php/File:C06694.01c155.png c155]'''
| align="center" style="background:#f0f0f0;"|'''[http://labadviser.nanolab.dtu.dk/index.php/File:C06694.01c157.png c157]'''
| align="center" style="background:#f0f0f0;"|'''[http://labadviser.nanolab.dtu.dk/index.php/File:C06694.01c153.png c153]'''
|- 
| Trench width (um)||0.21||0.79||0.84
|- 
| Etched depth (um)||1.08||1.27||1.41
|- 
| Etch rate (um/min)||0.24||0.28||0.31
|- 
| <span title="The cycles will vary if the aspect ratio is large "> Etch rate (nm/cyc) </span>||21.61||25.46||28.14
|- 
| Sidewall bowing (%)||0||1||0
|- 
| Sidewall angle (degs)||90.31||90.19||90.3
|- 
| Bottom bowing (%)||40.66||22.98||21.46
|- 
|Aspect ratio||5.04||1.6||1.67
|- 
|}
|- 
|16/6-2021
|150 mm wafer with standard DUV resist and a pattern of pillars of variable densities/widths
|Si /  10%
|C06695.14
|nanolab/ vy / DREM / DREM 0.5 kW v2.3 75 cyc or 6:52.5 mins
|C06694.01
|[http://labmanager.dtu.dk/function.php?module=Processlog&view=editlog&usageid=388881 Process log entry]
| 
[[file:C06695.14c159.png |120px|frameless ]]
[[file:C06695.14c160.png |120px|frameless ]]
[[file:C06695.14c161.png |120px|frameless ]]
[[file:C06695.14c162.png |120px|frameless ]]
[[file:C06695.14c163.png |120px|frameless ]]
| <!-- Add picoscope links here:[[file:C06694.14 |120px|frameless ]] -->
| 
{| {{table}} 
| align="center" style="background:#f0f0f0;"|'''SEM image:'''
|- 
| Trench width (um)
|- 
| Etched depth (um)
|- 
| Etch rate (um/min)
|- 
| <span title="The cycles will vary if the aspect ratio is large "> Etch rate (nm/cyc) </span>
|- 
| Sidewall bowing (%)
|- 
| Sidewall angle (degs)
|- 
| Bottom bowing (%)
|- 
|Aspect ratio
|- 
|}
|-
|27/9-2021
|DUV litho wafer,
|Si /  25-50%
|C06873.01
|nanolab/ jmli / DREM / DREM 0.5kW peg3, 100 cycles or 9:10 minutes
|C06873.02
|30 sec O2 0.2kW barc[http://labmanager.dtu.dk/function.php?module=Processlog&view=editlog&usageid=397212 Process log entry]
| 
[[file:C06873.02c156.png |120px|frameless ]]
[[file:C06873.02c157.png |120px|frameless ]]
[[file:C06873.02c158.png |120px|frameless ]]
[[file:C06873.02c159.png |120px|frameless ]]
[[file:C06873.02c160.png |120px|frameless ]]
[[file:C06873.02c161.png |120px|frameless ]]
[[file:C06873.02c162.png |120px|frameless ]]
[[file:C06873.02c163.png |120px|frameless ]]
| <!-- Add picoscope links here:[[file:C06873.02 |120px|frameless ]] -->
| 
{| {{table}} 
| align="center" style="background:#f0f0f0;"|'''SEM image:'''
| align="center" style="background:#f0f0f0;"|'''[http://labadviser.nanolab.dtu.dk/index.php/File:C06873.02c157.png c157]'''
| align="center" style="background:#f0f0f0;"|'''[http://labadviser.nanolab.dtu.dk/index.php/File:C06873.02c158.png c158]'''
| align="center" style="background:#f0f0f0;"|'''[http://labadviser.nanolab.dtu.dk/index.php/File:C06873.02c159.png c159]'''
| align="center" style="background:#f0f0f0;"|'''[http://labadviser.nanolab.dtu.dk/index.php/File:C06873.02c161.png c161]'''
| align="center" style="background:#f0f0f0;"|'''[http://labadviser.nanolab.dtu.dk/index.php/File:C06873.02c162.png c162]'''
| align="center" style="background:#f0f0f0;"|'''[http://labadviser.nanolab.dtu.dk/index.php/File:C06873.02c160.png c160]'''
| align="center" style="background:#f0f0f0;"|'''[http://labadviser.nanolab.dtu.dk/index.php/File:C06873.02c156.png c156]'''
| align="center" style="background:#f0f0f0;"|'''[http://labadviser.nanolab.dtu.dk/index.php/File:C06873.02c163.png c163]'''
|- 
| Trench width (um)||0.17||0.22||0.25||0.42||0.43||0.52||0.55||2.03
|- 
| Etched depth (um)||1.3||1.36||1.4||1.56||1.57||1.62||1.64||1.87
|- 
| Etch rate (um/min)||0.14||0.15||0.15||0.17||0.17||0.18||0.18||0.2
|- 
| <span title="The cycles will vary if the aspect ratio is large "> Etch rate (nm/cyc) </span>||13||14||14||16||16||16||16||19
|- 
| Sidewall bowing (%)||0||0.2||0.2||0.3||0.4||0.1||-0.1||0.1
|- 
| Sidewall angle (degs)||89.38||89.33||89.41||89.29||89.43||89.44||89.4||89.21
|- 
| Bottom bowing (%)||34.34||24.69||27.76||23.55||22.1||20.81||23.56||11.77
|- 
|Aspect ratio||8.11||6.63||5.94||3.85||3.77||3.22||3.1||0.93
|- 
|}
|- 
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