View source for Specific Process Knowledge/Characterization/XPS/Nexsa

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[[Category: Equipment |Characterization chemical]]
[[Category: Characterization|Chemical]]

== The XPS Nexsa ==

Name: XPS Nexsa<br>
Vendor: Thermofisher Scientific<br>
The XPS Nexsa offers a variety of surface analysis techniques in addition to its main XPS technique.

[[Image:NexsaOverview.PNG |frame|x300px|The Nexsa .]]


'''The user manual(s), user APV(s), technical information and contact information are be found in LabManager:''' 
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<!-- give the link to the equipment info page in LabManager: -->
[http://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=465  The XPS Nexsa in LabManager]

== Process information ==

'''The XPS Nexsa with '''<span title="The only analytical option (that means excluded chillers, factory training courses, UPS etc) not chosen is a vacuum transfer module " >''' ''all'' '''</span>''' but one options'''

XPS is a well established technique at DTU Nanolab; we know what we can get from it and so do the users. Take a look at the page of the [[Specific Process Knowledge/Characterization/XPS/K-Alpha|XPS K-Alpha]] to find more information.  The situation is slightly different with the other analytical techniques that the Nexsa offers. These options were not added because we have an urgent need for them in some project - rather, we chose to add them because we got an irresistible offer. Also, should any need for them arise in the future, the price of adding them once the instrument left the factory would be a lot higher. As a result, we don't have any applications waiting to explore what they can offer. 

It is clearly in everybody's interest that the techniques are explored - that we throw all kinds of samples at them and that we investigate what kind of knowledge we can extract. Ideally, all this knowledge that we require should be shared among all the users. We therefore strongly urge you to take a look at the techniques on the pages listed below. Here, we will collect technical information and publications.

*[[Specific Process Knowledge/Characterization/XPS/XPS technique|The XPS technique]]
*[[Specific Process Knowledge/Characterization/XPS/ISS|Ion Scattering Spectroscopy or ISS]]
*[[Specific Process Knowledge/Characterization/XPS/REELS|Reflected Electron Energy Loss Spectroscopy or REELS]]
*[[Specific Process Knowledge/Characterization/XPS/Raman|Raman spectroscopy]]
*[[Specific Process Knowledge/Characterization/XPS/UPS technique|Ultraviolet Photoelectron Spectroscopy or UPS)]]

== Getting access to the XPS ==

Click [[Specific Process Knowledge/Characterization/XPS/Access | '''HERE''' ]] to see information on how to get access to the XPS.

== Performance of XPS Nexsa ==

{| border="2" cellspacing="0" cellpadding="1" |-
!style="background:silver; color:black;" align="left"|Purpose 
|style="background:LightGrey; color:black"|Chemical analysis
|style="background:WhiteSmoke; color:black"|
* [[Specific Process Knowledge/Characterization/XPS/XPS elemental composition|Probing elemental composition]]
* [[Specific Process Knowledge/Characterization/XPS/XPS Chemical states |Chemical state identification]]
* Non destructive technique
* Surface sensitive
* [[Specific Process Knowledge/Characterization/XPS/XPS Depth profiling|Depth profiling]] possible by ion beam etch of sample
|-
!rowspan="5" style="background:silver; color:black" align="left"| Performance
|style="background:LightGrey; color:black"|Spot size
|style="background:WhiteSmoke; color:black"|Can be set between 30µm - 400µm
 
|-
|style="background:LightGrey; color:black"|Probing depth 
|style="background:WhiteSmoke; color:black"|Depending on probed element. Max probe depth lies within 10-200 Å. 
|-
|style="background:LightGrey; color:black"|Resolution
|style="background:WhiteSmoke; color:black"|Dependent on probed elements. Concentrations down to about 0,5 atomic % can in some cases be detected. 
|-
|style="background:LightGrey; color:black"|Charge compensation 
|style="background:WhiteSmoke; color:black"|
Flood gun can be used for charge compensation of non conductive samples
|-
|style="background:LightGrey; color:black"|Finding structures
|style="background:WhiteSmoke; color:black"|Choose measuring spot from camera image (magnified)
|-
|-
|-
!rowspan="2" style="background:silver; color:black" align="left"|Depth profiling
|style="background:LightGrey; color:black"|Purpose
|style="background:WhiteSmoke; color:black"|With ion beam etch the top layer of the material can be removed, to do a depth profiling
|-
|style="background:LightGrey; color:black"|Ion beam size
|style="background:WhiteSmoke; color:black"| About 3x1 mm

|-
!rowspan="2" style="background:silver; color:black" align="left"|Substrates
|style="background:LightGrey; color:black"|Substrate size
|style="background:WhiteSmoke; color:black"|
Maximum 60x60 mm
|-
| style="background:LightGrey; color:black"|Substrate thickness
|style="background:WhiteSmoke; color:black"|
Maximum height about 20 mm
|- 
|}

== Thermofisher sales documents ==

*[https://assets.thermofisher.com/TFS-Assets/MSD/brochures/BR52913-EN-Nexsa-XPS-Brochure.pdf Nexsa Surface Analysis System]