View source for Specific Process Knowledge/Etch/DRIE-Pegasus/Etch 3 dimensional silicon microstructures

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* ''This work was done by Henri Jansen and Bingdong Chang in 2017;''

* ''This page was last edited by Bingdong Chang 24 October 2017.''



By combining anisotropic Bosch process and isotropic etch process, 3 dimensional structures can be fabricated using DRIE-Pegasus, below is an example to show how 3D "sausage-chain-like" micropillars can be achieved. The patterns were defined with DUV lithography (1µm diameter structures with 2µm pitch size), the resist  used was 750nm KRF M230Y positive DUV resist.

<gallery caption="Recipe to achieve sausage-chain-like micropillars" widths="400" heights="300" perrow="2">
image: 3Drecipe.jpg
image: 3Drecipe1.jpg 
</gallery>

<gallery caption="SEM images of 3D sausage-chain-like micropillars" widths="400" heights="300" perrow="2">
image: 3Dstructures1.png
image: 3Dstructures2.png 
</gallery>

Using the similar methods, other types of 3D microstructures can be fabricated, below are some silicon structures etched with UV resist as a mask, the lithography step was performed with Aligner Maskless, with 1.5µm thick AZ nlof negative resist or 1.5µm AZ 5214 positive resist. 

<gallery caption="SEM images of other kinds of 3D silicon microstructures" widths="400" heights="300" perrow="2">
image: 3Dstructures3.png
image: 3Dstructures4.png
image: 3Dstructures5.png
image: 3Dstructures6.png 
</gallery>

For more details, please contact Henri Jansen (henrija@dtu.dk) or Bingdong Chang (bincha@dtu.dk)