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=Technology Development of 3D Silicon Plasma Etching process for Novel Devices and Applications=
*'''Project type:''' Ph.d. project
*'''Project responsible:''' Bingdong Chang
*'''Supervisors:'''Henri Jansen, Flemming Jensen, Jörg Hübner
*'''Partners involved:''' DTU Danchip

==Project Description==

==Publications in peer-reviewed journal papers==
===Publications as first author ===

'''DREM: Infinite etch selectivity and optimized scallop size distribution with conventional photoresists in an adapted multiplexed Bosch DRIE process''' 

<u>Chang, B.</u>, Leussink, P., Jensen, F., Hübner, J. and Jansen, H.,

Microelectronic Engineering, 191, pp.77-83 (2018) [https://doi.org/10.1016/j.mee.2018.01.034 DOI]

'''DREM2: a facile fabrication strategy for freestanding three dimensional silicon micro-and nanostructures by a modified Bosch etch process'''

<u>Chang, B.</u>, Jensen, F., Hübner, J. and Jansen, H

Journal of Micromechanics and Microengineering, 28(10), p.105012 (2018) [https://doi.org/10.1088/1361-6439/aad0c4 DOI]

'''Confined Growth of ZIF‐8 Nanocrystals with Tunable Structural Colors'''

<u>Chang, B.</u>, Yang, Y., Jansen, H., Ding, F., Mølhave, K. and Sun, H. 

Advanced Materials Interfaces, 5(9), p.1701270 (2018) [https://doi.org/10.1002/admi.201701270 DOI]

'''Highly Ordered 3D Silicon Micro‐Mesh Structures Integrated with Nanowire Arrays: A Multifunctional Platform for Photodegradation, Photocurrent Generation, and Materials Conversion'''

<u>Chang, B.</u>, Tang, Y., Liang, M., Jansen, H., Jensen, F., Wang, B., Mølhave, K., Hübner, J. and Sun, H.

ChemNanoMat (2018) [https://doi.org/10.1002/cnma.201800371 DOI]

'''Large Area Three- Dimensional Photonic Crystal Membranes: Single-Run Fabrication and Applications with Embedded Planar Defects'''

<u>Chang, B.</u>,  Zhou, C., Tarekegne, A., Yang, Y., Zhao, D., Jensen, F., Hübner, J., Jansen, H.

Advanced Optical Materials (2018) [https://doi.org/10.1002/adom.201801176 DOI]


===Publications as co-author ===
'''Inductively coupled plasma nanoetching of atomic layer deposition alumina'''

Han, A., <u>Chang, B.</u>, Todeschini, M., Le, H. T., Tiddi, W., and Keil, M.

Microelectronic Engineering (2018) [https://doi.org/10.1016/j.mee.2018.02.023  DOI]