View source for Specific Process Knowledge/Thermal Process/Jipelec RTP

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[[Category: Equipment |Furnace]]
[[Category: Thermal process|Furnace]]

==Jipelec - Rapid Thermal Processing==

[[Image:RTP_oven.jpg|300x300px|thumb|Jipelec RTP: Positioned in cleanroom A-4]]

The Jipelec is a rapid thermal processing (RTP) oven. It is be used for fast and well-controlled annealing or alloying of samples. It is possible to use either a thermocouple or a pyrometer to control the temperature (of the sample carrier).


'''The user manual, technical information and contact information can be found in LabManager:'''

'''[http://www.labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=164 Jipelec RTP]'''

==Overview of the performance of the Jipelec RTP and some process related parameters==
{| border="2" cellspacing="0" cellpadding="2" 
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!style="background:silver; color:black;" align="center"|Purpose 
|style="background:LightGrey; color:black"|
|style="background:WhiteSmoke; color:black"|RTP annealing
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!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Process parameter range
|style="background:LightGrey; color:black"|Process Temperature
|style="background:WhiteSmoke; color:black"|
*0-1000 <sup>o</sup>C
*Temperature ramp up to 300 <sup>o</sup>C/min
|-
|style="background:LightGrey; color:black"|Process pressure
|style="background:WhiteSmoke; color:black"|
*1 atm
*Vacuum
|-
|style="background:LightGrey; color:black"|Gasses on the system
|style="background:WhiteSmoke; color:black"|

*N<sub>2</sub>
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="2"|Substrates
|style="background:LightGrey; color:black"|Batch size
|style="background:WhiteSmoke; color:black"|
*One 100 mm wafer (or 50 wafer) per run
*Small samples (placed on a carbide carrier or a Si carrier wafer with 1 µm oxide)
|-
| style="background:LightGrey; color:black"|Substrate material allowed
|style="background:WhiteSmoke; color:black"|

A silicon carrier wafer with 1 µm oxide is always need (except for III-V materials)
*Silicon 
*Silicon oxides
*Silicon nitrides
*Quartz
*Polysilicon
*Titan
*III-V materials (on graphite carrier)
*Silicon wafers (new from the box or RCA cleaned)
*In doubt: look at [http://www.labmanager.danchip.dtu.dk/view_binary.php?fileId=1250 the cross contamination chart] or send a mail to [mailto:furnace@danchip.dtu.dk the Furnace group].
|- 
|}