View source for Specific Process Knowledge/Back-end processing/Polishing machine

'''Feedback to this page''': '''[mailto:danchipsupport@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://http://labadviser.danchip.dtu.dk/index.php?title=Specific_Process_Knowledge/Back-end_processing/Die_Bonder click here]'''
<!-- Replace "http://labadviser.danchip.dtu.dk/..." wih the link to the Labadviser page-->

== Polisher/Lapper [[Image:section under construction.jpg|70px]] ==

[[image:Logitech pm5 1.jpg|400px|right|thumb|The Logitech PM5 Polisher/Lapper]]

The Logitech PM5 Polisher/Lapper is for thinning down wafers and other substrates. 

'''The user manual, user APV(s), technical information and contact information can be found in LabManager:''' 
<!-- remember to remove the type of documents that are not present -->

<!-- give the link to the equipment info page in LabManager: -->
[http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=299 The Logitech PM5 Polisher/Lapper in LabManager]

==Equipment performance and process related parameters==

{| border="2" cellspacing="0" cellpadding="2" 

!colspan="2" border="none" style="background:silver; color:black;" align="center"|Equipment 
|style="background:WhiteSmoke; color:black"|<b>Polisher/Lapper</b>
<!-- |style="background:WhiteSmoke; color:black"|<b>Equipment 2</b> -->
|-
!style="background:silver; color:black;" align="center" width="60"|Purpose 
|style="background:LightGrey; color:black"| 
Thinning of substrates of
|style="background:WhiteSmoke; color:black"|
*InP
*GaAs
*Silicon
*Metals
*Glass/Quartz
<!-- |style="background:WhiteSmoke; color:black"|
*Purpose 1
*Purpose 2
*Purpose 3 -->
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="2"|Performance
|style="background:LightGrey; color:black"| Thinning
|style="background:WhiteSmoke; color:black"|
*Removal rate: 1-10µm/min
*Thickness accuracy: +/- 10 µm
*Thickness homogeneity: +/- 10 µm
*Roughness: +/- ? µm
<!-- |style="background:WhiteSmoke; color:black"|
*Performance range 1
*Performance range 2
*Performance range 3 -->
|-
|style="background:LightGrey; color:black"|Polishing
|style="background:WhiteSmoke; color:black"|
*Removal rate: ~1 µm/min
*Thickness accuracy: ? µm
*Thickness homogeneity: ? µm
*Roughness: +/- ? µm
<!-- |style="background:WhiteSmoke; color:black"|
*Performance range -->
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Process parameter range
|style="background:LightGrey; color:black"|Polishing liquid
|style="background:WhiteSmoke; color:black"|
*Al2O3 (alumina) powder: 3, 9 or 20 µm
*Chemlox (for polishing)
|-
|style="background:LightGrey; color:black"|Rotation speed
|style="background:WhiteSmoke; color:black"|
*Thinning: 5-20 rpm
*Polishing: 5-80 rpm
|-
|style="background:LightGrey; color:black"|Arm sweep
|style="background:WhiteSmoke; color:black"|
*Thinning: stationary
*Polishing: 12% (inner) - 80% (outer)
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates
|style="background:LightGrey; color:black"|Batch size
|style="background:WhiteSmoke; color:black"|
*<nowiki>#</nowiki> small samples
*one 50 mm wafer
*one 100 mm wafer
<!-- |style="background:WhiteSmoke; color:black"|
*<nowiki>#</nowiki> small samples
*<nowiki>#</nowiki> 50 mm wafers
*<nowiki>#</nowiki> 100 mm wafers
*<nowiki>#</nowiki> 150 mm wafers -->
|-
| style="background:LightGrey; color:black"|Allowed materials
|style="background:WhiteSmoke; color:black"|
*InP
*GaAs
*Silicon
*Metals
*Glass/Quartz
<!-- |style="background:WhiteSmoke; color:black"|
*Allowed material 1 
*Allowed material 2
*Allowed material 3 -->
|- 
|}

<br clear="all" />