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• 11:37, 12 January 2026 Jehem talk contribs created page Specific Process Knowledge/Lithography/Strip/plasmaAsher04 processDevelopment (Created page with "=Process gas ratio for plasma asher 4 & 5= 400px|thumb|Ashing rate as function of gas mix ratio when processing a single 100 mm wafer and when processing a full boat with 25 wafers. The green area (~50% N₂) covers the optimum range for both situations.|right The ashing rate is related to the gas mix, usually expressed as percentage of nitrogen of the total amount of gas. Process development tests found that a gas mix of 50% nitrogen...")