Specific Process Knowledge/Thermal Process/Storage and cleaning of wafer to the A, B, C and E stack furnaces
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A1 furnaces
- All wafers have to be RCA cleaned, this includes both new and processed wafers. The wafers should be cleaned the same day as they are going into the furnace. Remember to RCA clean a test wafers and dummy wafers (if needed).
- Before boron pre-deposition, the silicon carbide boat and boron source wafers have to be RCA cleaned.
A2 A3 and A4 furnaces
- All wafers have to be RCA cleaned, this includes both new and processed wafers. The wafers should be cleaned the same day as they are going into the furnace. Remember to RCA clean a test wafers and dummy wafers (if needed).
B2, B3, B4, E2 and E3 furnaces (LPCVD furnaces)
- New silicon wafers can go directly into the furnaces.
- Wafers from the A stack furnaces and the C1 furnace can go directly into the furnace.
- Other processed wafers and quartz wafers have to be RCA cleaned. The wafers can be cleaned the day before they are going into the furnace.
C1 furnace
- New silicon wafers can go directly into the furnaces.
- Wafers from the A, B and E stack furnaces and from PECVD4 can go directly into the furnace.
- Other processed wafers and quartz wafers have to be RCA cleaned. The wafers can be cleaned the day before they are going into the furnace.
C3 furnace
- New silicon wafers can go directly into the furnaces.
- Wafers from the A, B and E stack furnaces and from PECVD4 can go directly into the furnace.
- Other processed wafers and quartz wafers have to be RCA cleaned. The wafers can be cleaned the day before they are going into the furnace.
- Wafer pieces are allowed in the furnace, if these have been RCA cleaned.
All wafers have to be RCA cleaned.
Oxidation - Grow a thermal oxide on silicon