Specific Process Knowledge/Characterization

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Choose characterization topic

• Sample imaging
• Topographic measurement
• Stress measurement
• Measurement of film thickness and optical constants
• Wafer thickness measurement
• Element analysis
• Contact angle measurement
• Four-Point_Probe (Resistivity measurement)
• Carrier density (doping) profiler
• Scanning Electron Microscopy

Choose equipment

• SEM FEI - This instrument has been relocated to CEN
• SEM LEO
• SEM JEOL
• SEM Zeiss
• SEM Zeiss Supra 60 VP

• Nanoman - Atomic Force Microscopy

• Optical Profiler (Sensofar)
• Dektak XTA_new
• Dektak 8 stylus profiler

• Optical microscope

• Ellipsometer
• Filmtek 4000
• Prism Coupler
• PL mapper - Photoluminescence mapper
• Photoluminescence Mapper

• Atomika SIMS
• XPS-ThermoScientific

• Drop Shape Analyzer

• 4-Point Probe

• Thickness Measurer

• Probe station

• KLA-Tencor Surfscan 6420

• III-V ECV-profiler (Electrochemical Capacitance-Voltage carrier density profiler)
• X-Ray Diffractometer