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- 16:12, 9 January 2025 Jehem talk contribs created page Specific Process Knowledge/Lithography/Strip/PlasmaAsher2 (Created page with "300x300px|thumb|Plasma asher for removing AZ resist on 6" wafers: positioned in E-5 The Plasma Asher 2 is the same as Plasma Asher 1 but has another loading system which is more convenient for batch loading of 6inch substrates. In this machine, only O2 and N2 gases are used for processes (in PlasmaAsher1, CF4 is used as well). The typical process parameters when operating the equipment: *Photeresist stripping Pressure: 0.8 - 1.0 mbar...")