Specific Process Knowledge/Etch/DRIE-Pegasus/TrenchCharacterisation

Parameters


	In the image the following parameters are shown: Top Width (TW) Depth (D) Bottom Width (BW) Mid Width (MW) To speed up the characterisation post-SEM the parameter 'Pixel Size' (PS) is added to the SEM databar (the blue circle).
	Depth	D*PS
	Bowing	$2 \frac{M W - \frac{T W + B W}{2}}{(T W + B W)}$
	Sidewall angle	$a c o s (\frac{T W - t i n y \| B W}{2 \sqrt{D^{2} + \frac{1}{4} (T W^{2} - B W^{2})}})$