Specific Process Knowledge/Thin film deposition/Deposition of Silicon Oxide/SiO2 disk and granule source tests in Temescal October 2026: Difference between revisions
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== Processing and physical interpretation == | == Processing and physical interpretation == | ||
[[File:Eves_SiO2_Temescal_202610_Fig09_Power_active_time.png|thumb|center|900px|Figure 9. Power plotted against cumulative time in the sustained DEPOSIT phases. Alarm pauses and conditioning are removed from the time axis. The first 120 s after each restart remain as gaps in the curve; those seconds are still part of the deposition-phase clock. This time axis differs from elapsed wall-clock time. All-phase wall-clock plots and the complete raw records are included in the accompanying package.]] | [[File:Eves_SiO2_Temescal_202610_Fig09_Power_active_time.png|thumb|center|900px|Figure 9. Power plotted against cumulative time in the sustained DEPOSIT phases. Alarm pauses (caused by a recipe condition that issues an alarm message after 30 min of continuous heat; the value is corrected to 300 min for Run2) and conditioning are removed from the time axis. The first 120 s after each restart remain as gaps in the curve; those seconds are still part of the deposition-phase clock. This time axis differs from elapsed wall-clock time. All-phase wall-clock plots and the complete raw records are included in the accompanying package.]] | ||
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