Specific Process Knowledge/Thin film deposition/Deposition of Tungsten/Sputtering of W in Sputter Coater 3: Difference between revisions
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Sputter Coater 3 is mainly used for sample preparation before [[Specific_Process_Knowledge/Characterization/SEM: Scanning Electron Microscopy|SEM inspection]]. Usually, Au is sputtered on dielectric surfaces to compensate for charge build-up. Alternatively, many other materials can be sputtered if the setup allows (you need to have a turbo pump and Ar gas). Gold can be deposited even in pure oxygen plasma and only with roughing pumps. Fortunately, Sputter Coater 3 located in the basement of building 346, has both a turbo pump and an Ar working gas source. The pressure during the process is measured to be below 0.1 mBar. This page describes deposition of tungsten (W) with this instrument. | Sputter Coater 3 is mainly used for sample preparation before [[Specific_Process_Knowledge/Characterization/SEM: Scanning Electron Microscopy|SEM inspection]]. Usually, Au is sputtered on dielectric surfaces to compensate for charge build-up. Alternatively, many other materials can be sputtered if the setup allows (you need to have a turbo pump and Ar gas). Gold can be deposited even in pure oxygen plasma and only with roughing pumps. Fortunately, Sputter Coater 3 located in the basement of building 346, has both a turbo pump and an Ar working gas source. The pressure during the process is measured to be below 0.1 mBar. This page describes deposition of tungsten (W) with this instrument. | ||