Specific Process Knowledge/Thin film deposition/Deposition of Silicon Oxide/Deposition of Silicon Oxide using LPCVD TEOS: Difference between revisions
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==Deposition rate and refractive index:== | ==Deposition rate and refractive index:== | ||
The deposition rate is normally a little below 10 nm/min. But especially for short depositions, the deposition rate is higher and depends on the deposition time. The mean reason for this is that there is some TEOS (about 20-30) will be deposited during the pre- and post-deposition | The deposition rate is normally a little below 10 nm/min. But especially for short depositions, the deposition rate is higher and depends on the deposition time. The mean reason for this is that there is some TEOS (about 20-30 nm) will be deposited during the pre- and post-deposition steps, and this does not count as deposition time. The pre-deposition step is when the TEOS is introduced into the furnace tube before the deposition, and the pre-deposition step is when the TEOS gas line and mass flow controller are emptied through the furnace tube after the deposition. | ||
Before you use the furnace, it is recommended to look at process log to find the latest deposition rates. | Before you use the furnace, it is recommended to look at process log to find the latest deposition rates. | ||