Specific Process Knowledge/Thin film deposition/Cluster-based multi-chamber high vacuum sputtering deposition system: Difference between revisions
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Too high sputter power can cause target or sputter gun damage. Given the target/interface thermal limitations, such damage can be reduced/eliminated by using an appropriate maximum power. However, "appropriate" often equates to "low" and low power means low deposition rate. Once the appropriate power has been established for a given target/gun, never switch on and immediate increase power to that value! Always increase power slowly to its maximum value through a series of ramps. When the deposition run is complete, it is equally important to ramp down power at the same rate at ramp up, allowing the target to cool slowly to avoid thermal shock and the potential for target fracture. | Too high sputter power can cause target or sputter gun damage. Given the target/interface thermal limitations, such damage can be reduced/eliminated by using an appropriate maximum power. However, "appropriate" often equates to "low" and low power means low deposition rate. Once the appropriate power has been established for a given target/gun, never switch on and immediate increase power to that value! Always increase power slowly to its maximum value through a series of ramps. When the deposition run is complete, it is equally important to ramp down power at the same rate at ramp up, allowing the target to cool slowly to avoid thermal shock and the potential for target fracture. | ||
Table below shows the maximum power and maximum ramp up/down power for | Table below shows the maximum power and maximum ramp up/down power for available materials: | ||
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