Specific Process Knowledge/Thin film deposition/Cluster-based multi-chamber high vacuum sputtering deposition system: Difference between revisions

The load-lock chamber is the only part of the tool which can be accesed by user. Ventilation and pumping takes approximately 5 min. The chamber has its own turbo pump. Inside there is a shelf - a cassete with 10 slots. The images below shows the load-lock set-up and sample mounting. The shelf is designed to handle 6-inch wafers, which has to be placed into dedicated carrier rings. Those rings with wafers can be introduced to the cassete - shelf. Different adapter-holders can be used for operating with 4-inch wafers and small chips.