Specific Process Knowledge/Thin film deposition/Cluster-based multi-chamber high vacuum sputtering deposition system: Difference between revisions
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==Load-lock== | ==Load-lock== | ||
The load-lock chamber is the only part of the tool which can be accesed by user. Ventilation and pumping takes approximately 5 min. The chamber has its own turbo pump. Inside there is a shelf - a cassete with 10 slots. The images below shows the load-lock set-up and sample mounting. The shelf is designed to handle 6'' wafers, which has to be placed into dedicated carrier rings. Those rings with wafers can be introduced to the cassete - shelf. Different adapter-holders can be used for operating with 4'' wafers and small chips. | |||
<gallery caption="Deposition rates of HfO2 at different temperaturs. ALD window." widths="800px" heights="600px" | <gallery caption="Deposition rates of HfO2 at different temperaturs. ALD window." widths="800px" heights="600px" | ||
00px" perrow="2"> | 00px" perrow="2"> | ||
image:Kaempe_Lesker_Load_Loak_image1.png| | image:Kaempe_Lesker_Load_Loak_image1.png| The load-lock chamber. | ||
image:Kaempe_Lesker_Load_Loak_image2.png| | image:Kaempe_Lesker_Load_Loak_image2.png| Sample holder, carrier ring and load lock shelf. | ||
</gallery> | </gallery> | ||
<b>Attention!</b> The shelf turns opposite side from when the carrier ring is loading in. Furthermore, the shelf has to be placed properly inside the load lock chamber. A carrier ring without sample should never be loaded in the load lock. The light in the load lock chamber can be turned on. The light switch is located on the left side of the load-lock. Process chambers PC 1 and PC 3 are also equipted with light switches. | |||
=Process information= | =Process information= | ||