Specific Process Knowledge/Thin film deposition/Cluster-based multi-chamber high vacuum sputtering deposition system: Difference between revisions
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==Substrate cleaning (RF Bias)== | ==Substrate cleaning (RF Bias)== | ||
The RF cleaning can be used to clean the sample before the deposition. There are | The RF cleaning can be used to clean the sample before the deposition. There are depicted recipes for that: | ||
* If PC1 is used, select “Master Bias PC1_Upstream” | * If PC1 is used, select “Master Bias PC1_Upstream” | ||