Specific Process Knowledge/Thin film deposition/Cluster-based multi-chamber high vacuum sputtering deposition system: Difference between revisions
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= Sputtering deposition system set-up= | = Sputtering deposition system set-up= | ||
The cluster sputter system is used for deposition of metals, magnetic metals and dielectrics on a single wafer 4" or 6" wafer or several small samples. Samples will be placed | The cluster sputter system is used for deposition of metals, magnetic metals and dielectrics on a single wafer 4" or 6" wafer or several small samples. Samples will be placed on the ten shelves cassette and loaded in the load lock module. After the load lock chamber is pumped down, the sample can be transferred to the desired process chamber. The sample will be rotated over the target and can be heated up to 600C while depositing the film. The system is equipped with two process chambers connected to a wafer transfer robot, and a load lock chamber. | ||
<gallery caption="System set-up and power supply configuration." widths="1000px" heights="600px" perrow="1"> | <gallery caption="System set-up and power supply configuration." widths="1000px" heights="600px" perrow="1"> | ||
image:Kaempe_Lesker_image_overview_main.png| The system set-up showing the different | image:Kaempe_Lesker_image_overview_main.png| The system set-up showing the different operation chambers and power supplies network.<br><b>*HSM</b> - High Strengh Magnet.<br><b>**RGA</b> - Residual Gas Analyser. | ||
</gallery> | </gallery> | ||