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Specific Process Knowledge/Thin film deposition/Deposition of Silicon Nitride/Deposition of Silicon Nitride using PECVD: Difference between revisions

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Jmli (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers
4,580 edits
Jmli (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers
4,580 edits
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*[http://labmanager.danchip.dtu.dk/d4Show.php?id=1402&mach=106 The QC procedure for PECVD3]<br>
*[http://labmanager.nanolab.dtu.dk/d4Show.php?id=1402&mach=106 The QC procedure for PECVD3]<br>
*[http://www.labmanager.danchip.dtu.dk/view_binary.php?type=data&mach=106 The newest QC data for PECVD3]<br>
*[http://www.labmanager.dtu.dk/view_binary.php?type=data&mach=106 The newest QC data for PECVD3]<br>
{| {{table}}
{| {{table}}
| align="center" |  
| align="center" |  
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!PECVD3
!PECVD3
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|Depoition rate
|Deposition rate
|~40 nm/min
|~40 nm/min
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