LabAdviser/Technology Research/Nanofabrication of Inductive Components for Integrated Power Supply On Chip: Difference between revisions
| Line 60: | Line 60: | ||
'''Fabricated Microinductors''': | '''Fabricated Microinductors''': | ||
[[File:Inductor_Results_1.jpg|500px]] | [[File:Inductor_Results_1.jpg|500px]] | ||
SEM micrographs of MEMS air-core inductors, (a) toroidal inductors with 16 mm2 | SEM micrographs of MEMS air-core inductors, (a) toroidal inductors with 16 mm2 (1.5 mm outer radius, 0.75 mm inner radius, 25 turns) and 4 mm2 footprint (inset) Presented by the lines and arrows, the current fows from the top wire bonding pad, through the TSV interconnects, then passing through the windings and exits at the lower pad. The measurement pads are designed in ground-signal-ground (GSG) | ||
(1.5 mm outer radius, 0.75 mm inner radius, 25 turns) and 4 mm2 footprint (inset) Presented | configuration at both terminals for wafer-level probing. Four 800 µm by 800 µm pads at the corners are for flip-chip bonding. (b) 1:1 toroidal transformer. The primary coil has larger conductors than that of the secondary coil. (c) solenoid inductor, (d) spiral inductor, (e) "DTU" inductor. | ||
by the lines and arrows, the current | |||
interconnects, then passing through the windings and exits at the lower pad. The measurement | |||
pads are designed in ground-signal-ground (GSG) configuration at both terminals for wafer-level | |||
probing. Four 800 µm by 800 µm pads at the corners are for | |||
flip-chip bonding. (b) 1:1 toroidal | |||
transformer. The primary coil has larger conductors than that of the secondary coil. (c) solenoid | |||
inductor, (d) spiral inductor, (e) | |||
=Technology Development= | =Technology Development= | ||