LabAdviser/Technology Research/Fabrication of Hyperbolic Metamaterials using Atomic Layer Deposition/AZO gratings: Difference between revisions
Appearance
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!1.1 | !1.1 | ||
|Plasma surface treatment | |Plasma surface treatment. | ||
|To ensure clean surface, the 100 mm Si wafer is treated by O<sub>2</sub>/N<sub>2</sub> plasma. (Optional step) | |To ensure clean surface, the 100 mm Si wafer is treated by O<sub>2</sub>/N<sub>2</sub> plasma. (Optional step) | ||
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|- style="background:#BCD4E6; color:black" | |- style="background:#BCD4E6; color:black" | ||
!1.2 | !1.2 | ||
|DUV Resist patterning | |DUV Resist patterning. | ||
|DUV | |DUV | ||
|[[Specific_Process_Knowledge/Lithography/DUVStepperLithography|DUV Stepper Lithography]]. | |[[Specific_Process_Knowledge/Lithography/DUVStepperLithography|DUV Stepper Lithography]]. | ||
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!1.3 | !1.3 | ||
|Deep reactive ion etching (DRIE) | |Deep reactive ion etching (DRIE). | ||
|DRIE; [[Specific_Process_Knowledge/Etch/DRIE-Pegasus/DUVetch|Recipe: PolySOI10]] Recipe needs to be tuned. Adjusted parameters: temperature, etching and passivation times. | |DRIE; [[Specific_Process_Knowledge/Etch/DRIE-Pegasus/DUVetch|Recipe: PolySOI10]] Recipe needs to be tuned. Adjusted parameters: temperature, etching and passivation times. | ||
| [[Specific_Process_Knowledge/Etch/DRIE-Pegasus|DRIE Pegasus]]. | | [[Specific_Process_Knowledge/Etch/DRIE-Pegasus|DRIE Pegasus]]. | ||
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|- style="background:#BCD4E6; color:black" | |- style="background:#BCD4E6; color:black" | ||
!1.4 | !1.4 | ||
|Plasma surface treatment | |Plasma surface treatment. | ||
|To ensure that remainings of DUV resist are gone, samples are treated by O<sub>2</sub>/N<sub>2</sub> plasma. (Optional step) | |To ensure that remainings of DUV resist are gone, samples are treated by O<sub>2</sub>/N<sub>2</sub> plasma. (Optional step) | ||
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!1.5 | !1.5 | ||
|Scanning Electron Microscopy inspection | |Scanning Electron Microscopy inspection. | ||
|By cleaving the sample it is possible to inspect DRIE etched Si trenches in cross-sectional mode | |By cleaving the sample it is possible to inspect DRIE etched Si trenches in cross-sectional mode. | ||
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[[Specific_Process_Knowledge/Characterization/SEM_Supra_1|SEM Supra 1]] | [[Specific_Process_Knowledge/Characterization/SEM_Supra_1|SEM Supra 1]] | ||
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|- style="background:#BCD4E6; color:black" | |- style="background:#BCD4E6; color:black" | ||
!1.6 | !1.6 | ||
|Atomic Layer Deposition of Al-doped ZnO (AZO) | |Atomic Layer Deposition of Al-doped ZnO (AZO). | ||
|Deposition carried at 200<sup>o</sup>C. Thickness is above 100 nm. | |Deposition carried at 200<sup>o</sup>C. Thickness is above 100 nm. | ||
||Equipment used: [[Specific_Process_Knowledge/Thin_film_deposition/ALD_Picosun_R200|ALD Picosun R200]]. Standard recipe used: [[Specific_Process_Knowledge/Thin_film_deposition/ALD_Picosun_R200/AZO_deposition_using_ALD| AZO 20T]]. | ||Equipment used: [[Specific_Process_Knowledge/Thin_film_deposition/ALD_Picosun_R200|ALD Picosun R200]]. Standard recipe used: [[Specific_Process_Knowledge/Thin_film_deposition/ALD_Picosun_R200/AZO_deposition_using_ALD| AZO 20T]]. | ||
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!1.7 | !1.7 | ||
|Scanning Electron Microscopy inspection | |Scanning Electron Microscopy inspection. | ||
|By cleaving the sample it is possible to inspect ALD coatings deposited on Si trenches in cross-sectional mode | |By cleaving the sample it is possible to inspect ALD coatings deposited on Si trenches in cross-sectional mode. | ||
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[[Specific_Process_Knowledge/Characterization/SEM_Supra_1|SEM Supra 1]] | [[Specific_Process_Knowledge/Characterization/SEM_Supra_1|SEM Supra 1]] | ||
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!1.9 | !1.9 | ||
|Scanning Electron Microscopy inspection | |Scanning Electron Microscopy inspection. | ||
|By cleaving the sample it is possible to inspect IBE etching results in cross-sectional mode | |By cleaving the sample it is possible to inspect IBE etching results in cross-sectional mode. | ||
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[[Specific_Process_Knowledge/Characterization/SEM_Supra_1|SEM Supra 1]] | [[Specific_Process_Knowledge/Characterization/SEM_Supra_1|SEM Supra 1]] | ||