Specific Process Knowledge/Thin film deposition/Deposition of Silicon Oxide/SiO2 disk and granule source tests in Temescal October 2026: Difference between revisions
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Two source-loading configurations were tested in the E-Beam Evaporator (10-pockets) on 22 and 23 October 2026. Each run used four solid, circular SiO<sub>2</sub> disks in a graphite liner and a nominal thickness setpoint of 600 nm at 1 Å/s. Run 1 used the disks alone. Run 2 used new disks with SiO<sub>2</sub> granules between the stack and liner wall. Both runs used a HULA (high uniformity lift-off assembly) holder. | Two source-loading configurations were tested in the E-Beam Evaporator (10-pockets) on 22 and 23 October 2026. Each run used four solid, circular SiO<sub>2</sub> disks in a graphite liner and a nominal thickness setpoint of 600 nm at 1 Å/s. Run 1 used the disks alone. Run 2 used new disks with SiO<sub>2</sub> granules between the stack and liner wall. Both runs used a HULA (high uniformity lift-off assembly) holder. | ||
The disks alone developed a narrow cavity that penetrated the entire stack. Adding granules and changing to a horizontal figure-eight sweep produced a more manageable deposition: repeated small rate spikes persisted, but the run finished without the major instability or growing liner-exposure concern described for Run 1. The deepest penetration stopped at the interface between the third and fourth disks. | The disks alone developed a narrow cavity that penetrated the entire stack. <em>Adding granules and changing to a horizontal figure-eight sweep produced a more manageable deposition: repeated small rate spikes persisted, but the run finished without the major instability or growing liner-exposure concern</em> described for Run 1. The deepest penetration stopped at the interface between the third and fourth disks. | ||
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