Specific Process Knowledge/Thin film deposition/Cluster-based multi-chamber high vacuum sputtering deposition system: Difference between revisions
Appearance
No edit summary |
|||
| Line 431: | Line 431: | ||
*Acceptance test [[:File:Cluster Lesker P1 and P3 Acceptance test FOR LA PUBLICATION.pdf]] | *Acceptance test [[:File:Cluster Lesker P1 and P3 Acceptance test FOR LA PUBLICATION.pdf]] | ||
==Maximum Power Calculation== | |||
* <math>PD</math> - Power density (fundamental constant given by a supplier) | |||
* <math>P(W)</math> - Power (W) from power supply | |||
* <math>A(inch^2)</math> - Area of the target | |||
------------------------------------------------------------------------------------------------------------ | |||
<math> PD=\frac{P(W)}{A(inch^2)}</math> ⇒ <math>P(W)=PD\cdot A(inch^2)=PD\cdot\frac{\pi d^2}{4}</math> | |||
<ul> | |||
<li><p> <b><span style="color: green">d=2" (2-inch target)</span></b> <math>P(W)=3.14\cdot PD</math> </p></li> | |||
<li><p> <b><span style="color: green">d=3" (3-inch target)</span></b> <math>P(W)=7.065\cdot PD</math> </p></li> | |||
<li><p> <b><span style="color: green">d=4" (4-inch target)</span></b> <math>P(W)=12.56\cdot PD</math> </p></li> | |||
<li><p> <b><span style="color: green">d=6" (6-inch target)</span></b> <math>P(W)=28.26\cdot PD</math> </p></li> | |||
</ul> | |||
-------------------------------------------------- | |||
Value of the <math>PD</math> is material dependent and can be found on KJLC homepage | |||