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Specific Process Knowledge/Thin film deposition/Cluster-based multi-chamber high vacuum sputtering deposition system: Difference between revisions

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Eves (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers
4,346 edits
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{| border="2" cellspacing="0" cellpadding="2"  
{| border="2" cellspacing="0" cellpadding="2"  


!colspan="6" border="none" style="background:silver; color:black;" align="center"|Power Supply ID  
!colspan="1" border="none" style="background:silver; color:black;" align="center"|Power Supply ID  
|style="background:WhiteSmoke; color:black"|<b>Type</b>
|style="background:WhiteSmoke; color:black"|<b>Type</b>
|style="background:WhiteSmoke; color:black"|<b>Maximum output power (W)</b>
|style="background:WhiteSmoke; color:black"|<b>Maximum output power (W)</b>
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