LabAdviser/Technology Research/Technology Development of 3D Silicon Plasma Etching process for Novel Devices and Applications: Difference between revisions
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===Publications as co-author === | ===Publications as co-author === | ||
'''Inductively coupled plasma nanoetching of atomic layer deposition alumina''' | :;'''Inductively coupled plasma nanoetching of atomic layer deposition alumina''' | ||
Han, A., <u>Chang, B.</u>, Todeschini, M., Le, H. T., Tiddi, W., and Keil, M. | :Han, A., <u>Chang, B.</u>, Todeschini, M., Le, H. T., Tiddi, W., and Keil, M. | ||
Microelectronic Engineering (2018) [https://doi.org/10.1016/j.mee.2018.02.023 DOI] | :Microelectronic Engineering (2018) [https://doi.org/10.1016/j.mee.2018.02.023 DOI] | ||